公开(公告)号：EP0340376A1

公开(公告)日：1989-11-08

申请号：EP88830200.7

申请日：1988-05-09

Applicant: CISEL - S.P.A. ,  R.I.C.O. - S.R.L.

Inventor： Saraceni, Maurizio ,  Saraceni, Luciano

IPC: H05K3/40 ,  H05K3/28

CPC classification number: H05K3/4069 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0145

Abstract: A circuit board of which the main wires (2), which are conventionally printed, by silk screening on one side of a polyester film (1), are covered and protected by a second film of polyester (5) which also covers the holes (1a) made in the film (1) at the various intersection points at which the electric contact is made between the main and secondary wires (4), which are subsequently silk-printed on the other side of the film (1) and if necessary covered by a layer of protecting varnish (6).

Abstract translation: 这样一种电路板，其中的主导线（2），其是传统的打印，通过丝网印刷在聚酯薄膜（1）的一侧上覆盖和聚酯的第二受保护的电影（5），其覆盖所述孔（ 1a）的在膜（1）在其中电接触在主，副线之间所作的各种交叉点由（4），其随后丝印刷在该膜的另一侧（1），如果必要 通过保护漆（6）的一个层覆盖。