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384 条记录 (耗时 0.025 秒)

    SOCKET FOR ELECTRIC COMPONENTS
    1.
    发明公开
    SOCKET FOR ELECTRIC COMPONENTS 审中-公开

    公开(公告)号：EP3734775A1

    公开(公告)日：2020-11-04

    申请号：EP18896679.0

    申请日：2018-12-13

    申请人： Enplas Corporation

    发明人： HACHUDA, Osamu

    IPC分类号： H01R33/76 ,  G01R31/26

    摘要： To provide a socket for electrical component that allows an electrical component to be easily accommodated and to be able to be accommodated and be used even if the electrical component is large. The IC socket 10 comprises a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the IC package 11; and a lever member 17 for pressing the cover member 15. The cover member 15 and the lever member 17 are rotatably connected to the same side end side of the socket body 13, and a pressing means 25, for pushing down the cover member 15 by closing the lever member 17 at the state that the cover member 15 is closed, is provided.

    MARKER MOUNTING UNIT
    2.
    发明公开
    MARKER MOUNTING UNIT 审中-公开

    公开(公告)号：EP3537099A1

    公开(公告)日：2019-09-11

    申请号：EP18738627.1

    申请日：2018-01-12

    申请人： Enplas Corporation

    发明人： FUKUDA Yasuyuki ,  SAITO Tomohiro

    IPC分类号： G01B11/00 ,  G01B11/26

    摘要： The present invention provides a marker mounting unit for mounting, for example, a marker such as a RAS marker that can accurately detect the detection reference portion. A marker mounting unit (1) according to the present invention includes an upper substrate (10) and a lower substrate (11). The marker mounting unit (1) is a laminate in which the upper substrate (10) is stacked on the lower substrate (11). The upper substrate (10) has a through hole (102). The lower substrate (11) has a bump (112) serving as a detection reference portion at a position corresponding to the through hole (102) of the upper substrate (10). The bump (112) of the lower substrate (11) is inserted into the through hole (102) of the upper substrate (10). In the laminate, an upper surface (112a) of the bump (112) of the lower substrate (11) is positioned lower than an upper surface of the upper substrate (10).

    INJECTION MOLDED IMPELLER
    3.
    发明公开
    INJECTION MOLDED IMPELLER 审中-公开

    公开(公告)号：EP3527831A1

    公开(公告)日：2019-08-21

    申请号：EP17859471.9

    申请日：2017-09-12

    申请人： Enplas Corporation

    发明人： YAMAGUCHI, Tetsuo

    IPC分类号： F04D29/30 ,  B29C45/44 ,  F04D29/28

    摘要： PROBLEM TO BE SOLVED: To provide an injection-molded impeller that ensures preventing burrs on surface ridgelines of vanes during injection molding and ensures reduction in a production cost required to remove the burrs on the vanes.
    SOLUTION: An injection-molded impeller (1) includes a center shaft portion (3) and a plurality of vanes (5). The plurality of vanes (5) are formed at a peripheral area of the center shaft portion (3) at regular intervals. The injection-molded impeller (1) is rotated around an axial center CL of the center shaft portion (3) to flow out a fluid flowed in between the adjacent vanes (5, 5) from a direction along the axial center CL of the center shaft portion (3) toward a radially outer side. The vanes (5) include non-deflecting shape portions (10) and arc-shaped flow deflecting portions (13). The non-deflecting shape portions (10) linearly extend from the center shaft portion (3) along a radial direction. The flow deflecting portions (13) extend from the non-deflecting shape portions (10) to radially outward ends. The vanes (5) are formed in a spiral pattern from one end (7) side to another end (8) side along the axial center CL of the center shaft portion (3).

    EMITTER AND TUBE FOR DRIP IRRIGATION
    7.
    发明公开
    EMITTER AND TUBE FOR DRIP IRRIGATION 审中-公开

    公开(公告)号：EP3479681A1

    公开(公告)日：2019-05-08

    申请号：EP17819670.5

    申请日：2017-05-10

    申请人： Enplas Corporation

    发明人： KIDACHI, Masahiro

    IPC分类号： A01G25/02

    摘要： This emitter is configured from an emitter body, a film, and a cover. The emitter has a water intake part, a discharge part, a first flow path, a second flow path, a flow reduction part, a flow path opening/closing part, a pressure-reducing flow path, and a bypass flow path. If the pressure of an irrigation liquid flowing through a tube is less than a first pressure, the opening of a first water intake through hole of the cover is sealed with the film. If the pressure of the irrigation liquid flowing through the tube is equal to or greater than the first pressure, the film is deformed so that the irrigation liquid is taken into the emitter body through the first water intake through hole, the space between the film and the cover, and a second water intake through hole.

    OPTICAL RECEPTACLE AND OPTICAL MODULE
    9.
    发明公开
    OPTICAL RECEPTACLE AND OPTICAL MODULE 审中-公开

    公开(公告)号：EP3361298A1

    公开(公告)日：2018-08-15

    申请号：EP16851209.3

    申请日：2016-09-16

    申请人： Enplas Corporation

    发明人： MORIOKA, Shimpei ,  KON, Ayano

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4214 ,  G02B6/42 ,  G02B6/4204 ,  G02B6/4286 ,  G02B6/4292 ,  G02B27/10

    摘要： This optical receptacle has a first optical surface, a reflection surface, a second optical surface, a light separation part, and a third optical surface. On the first optical surface, light from a photoelectric conversion element is incident. The reflection surface reflects the light incident on the first optical surface. The second optical surface allows the light reflected by the reflection surface to be emitted toward an end surface of an optical transmission body. The light separation part separates the light reflected by the reflection surface, into monitor light and signal light. The third optical surface allows the monitor light to be emitted toward a detection element. The light separation part includes divided reflection surfaces and divided transmission surfaces. At least one of the divided transmission surfaces includes one or more widened portions each having a width larger than those of the other divided transmission surfaces.