摘要:
Disclosed are methods and apparatus for cleaning a substrate involving the application of optical energy to the substrate, typically in the form of a beam of light, where the energy of the beam causes removal of the contaminant from substrate. The cleaning may occur via any mechanism, including one or more of, alone or in any combination, ablation, melting, heating or reaction with the substrate or contaminant or agent introduced to aid in the cleaning. The optical energy is typically applied to a selected area of the substrate (e.g., as a beam), and the substrate and beam or optical energy source moved relative to one another so as to clean a larger area of the substrate, either by moving the substrate or the beam, or both. Movement of the beam with respect to the substrate can be attained through a beam scanning mechanism or through movement of the optical source itself.
摘要:
Disclosed are methods and apparatus for cleaning a substrate, such as a fabric material, involving the application of optical energy to the substrate, typically in the form of a beam of light, where the energy of the beam causes removal of the contaminant from substrate, such as from the fibres of a fabric material. The cleaning may occur via any mechanism, including one or more of, alone or in any combination, ablation, melting, heating or reaction with the substrate or contaminant or agent introduced to aid in the cleaning. The optical energy is typically applied to a selected area of the substrate (e.g., as a beam), and the substrate and beam or optical energy source moved relative to one another so as to clean a larger area of the substrate, either by moving the substrate or the beam, or both. Movement of the beam with respect to the substrate can be attained through a beam scanning mechanism or through movement of the optical source itself.
摘要:
Disclosed are methods and apparatus for cleaning a substrate involving the application of optical energy to the substrate, typically in the form of a beam of light, where the energy of the beam causes removal of the contaminant from substrate. The cleaning may occur via any mechanism, including one or more of, alone or in any combination, ablation, melting, heating or reaction with the substrate or contaminant or agent introduced to aid in the cleaning. The optical energy is typically applied to a selected area of the substrate (e.g., as a beam), and the substrate and beam or optical energy source moved relative to one another so as to clean a larger area of the substrate, either by moving the substrate or the beam, or both. Movement of the beam with respect to the substrate can be attained through a beam scanning mechanism or through movement of the optical source itself.
摘要:
A method of cleaning a substrate (16, 24, 34, 64, 71, 82, 102, 165, 171, 181, 201, 300, 310) with optical energy can comprise applying optical energy from a source of optical energy (12, 21, 31, 91, 103, 114, 121, 131, 141, 151, 164, 191, 202) to the substrate. The method can comprise applying the optical energy to a substrate having a cleaning agent applied thereto, the optical energy having one or more optical parameters selected for cleaning the substrate. A cleaning appliance can comprise an appliance body (80, 90, 104, 125) comprising an aperture for emanating optical energy for cleaning the substrate and an optical transmission pathway arranged for propagating optical energy received from an optical energy source to said aperture. The appliance can be adapted and constructed for delivering a cleaning agent to the substrate. The cleaning appliance can include a suction pump (142) for removing material from the substrate.