PACKAGED OPTICAL MICRO-MECHANICAL DEVICE
    2.
    发明公开
    PACKAGED OPTICAL MICRO-MECHANICAL DEVICE 审中-公开
    微机械结构在外壳

    公开(公告)号:EP1410084A2

    公开(公告)日:2004-04-21

    申请号:EP02744371.2

    申请日:2002-06-11

    IPC分类号: G02B6/36

    CPC分类号: B81B7/007 G02B6/4231

    摘要: A packaged optical micro-mechanical device. A die (24) includes one or more optical micro-mechanical devices (43) on a first surface of a substrate. The first surface includes a die reference surface (42). A package frame (20) includes an aperture (22) and a package frame reference surface (28) proximate the aperture adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more V-grooves (50) are positioned relative to an optical interface reference plane (44) adjacent to the micro-mechanical devices and terminating adjacent to the aperture. One or more optical fibers are located in the V-grooves optically coupled with one or more of the optical micro-mechanical devices.