公开(公告)号：EP1844486A1

公开(公告)日：2007-10-17

申请号：EP06701154.4

申请日：2006-01-24

申请人： ABB Technology AG

发明人： GENTSCH, Dietmar ,  PILSINGER, Günter

IPC分类号： H01H33/66

CPC分类号： H01H33/664 ,  H01H1/0206 ,  H01H11/045 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49206

摘要： The invention relates to a method for producing a contact piece, for use in a vacuum interrupter chamber, especially in a low, medium or high voltage vacuum interrupter chamber, according to the preamble of claim 1, and to a contact piece for a medium voltage vacuum interrupter chamber according to the preamble of claim 12. The aim of the invention is to improve multi-layer contact systems in such a manner that even larger layer thicknesses can be used to improve the electrical properties. For this purpose, the contact piece is constituted of at least two layers with a solder film inserted thereinbetween, said layers being welded together in a vacuum furnace in a desired relative position to each other. The two-layer structure can also be achieved by a powder layering process. For this purpose, the powder layers are compressed in a compression mold and then sintered in the furnace to give the finished contact piece blank.

公开(公告)号：EP2158053B1

公开(公告)日：2013-07-10

申请号：EP08758806.7

申请日：2008-05-28

申请人： ABB Technology AG

发明人： GENTSCH, Dietmar ,  PILSINGER, Günter

IPC分类号： B22F3/02 ,  H01H11/04

CPC分类号： H01H11/048 ,  B22F3/1283 ,  B22F2003/166 ,  B22F2998/00 ,  B22F2999/00 ,  B22F3/1216 ,  B22F3/1233 ,  B22F3/1007 ,  B22F2201/013 ,  B22F2201/20

公开(公告)号：EP1844486B1

公开(公告)日：2015-03-04

申请号：EP06701154.4

申请日：2006-01-24

申请人： ABB Technology AG

发明人： GENTSCH Dr., Dietmar ,  PILSINGER, Günter

IPC分类号： H01H33/66

CPC分类号： H01H33/664 ,  H01H1/0206 ,  H01H11/045 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49206

公开(公告)号：EP2158053A1

公开(公告)日：2010-03-03

申请号：EP08758806.7

申请日：2008-05-28

申请人： ABB Technology AG

发明人： GENTSCH, Dietmar ,  PILSINGER, Günter

IPC分类号： B22F3/02 ,  H01H11/04

CPC分类号： H01H11/048 ,  B22F3/1283 ,  B22F2003/166 ,  B22F2998/00 ,  B22F2999/00 ,  B22F3/1216 ,  B22F3/1233 ,  B22F3/1007 ,  B22F2201/013 ,  B22F2201/20

摘要： The invention relates to a method for production of a contact piece for a switchgear assembly, and to a contact piece itself, as claimed in the preamble of patent claims 1 and 15. In order in this case to introduce the slot and to apply a contact outer contour directly during the powder-metallurgical production process of the contact material, the ivention proposes that contouring, in particular via a thin plastic film, in the form of a slot or slots is introduced into the component and/or into the contact piece and/or into the powder-metal material, which is located in a mold, essentially in a direction parallel to the normal to the surface of the component or contact piece.