专利检索 ap:("ACTEL CORPORATION") AND inv:"ISSAQ, A., Farid" 第 1 页

1.

发明公开
REPROGRAMMABLE METAL-TO-METAL ANTIFUSE EMPLOYING CARBON-CONTAINING ANTIFUSE MATERIAL 审中-公开
标题翻译：可重复编程的金属对金属与碳反熔丝ANTIFUSEMATERIAL

公开(公告)号：EP1721338A2

公开(公告)日：2006-11-15

申请号：EP05723572.3

申请日：2005-02-22

申请人： ACTEL CORPORATION

发明人： ISSAQ, A., Farid , HAWLEY, Frank , MCCOLLUM, John

IPC分类号： H01L31/0256 , H01L29/00 , H01L31/0312 , H01L23/48

CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/3011 , H01L2924/00

摘要： A reprogrammable metal-to-metal antifuse is disposed between two metal interconnect layers in an integrated circuit. A lower barrier layer is formed from Ti. A lower adhesion-promoting layer is disposed over the lower Ti barrier layer. An antifuse material layer selected from a group comprising at least one of amorphous carbon and amorphous carbon doped with at least one of hydrogen and fluorine is disposed over the lower adhesion-promoting layer. An upper adhesion-promoting layer is disposed over the antifuse material layer. An upper Ti barrier layer is disposed over the upper adhesion-promoting layer.