摘要:
The invention concerns a process for increasing the scratch resistance of a glass substrate by implantation of simple charge and multicharge ions, comprising maintaining the temperature of the area of the glass substrate being treated at a temperature that is less than or equal to the glass transition temperature of the glass substrate, selecting the ions to be implanted among the ions of Ar, He, and N, setting the acceleration voltage for the extraction of the ions at a value comprised between 5 kV and 200 kV and setting the ion dosage at a value comprised between 10 14 ions/cm² and 2,5 x 10 17 ions/cm².The invention further concerns glass substrates comprising an area treated by implantation of simple charge and multicharge ions according to this process and their use for reducing the probability of scratching on the glass substrate upon mechanical contact.
摘要:
The invention relates to a glass substrate for chemical strengthening where a side is treated by ion implantation so as to reduce the extent of ion exchange upon chemical strengthening. Other embodiments relate to a method for making a chemically strengthened glass substrate with controlled curvature comprising: providing a substrate having first and second opposing sides, wherein the substrate presents in the surface layer of at least part of the first side a first ion implantation profile that reduces the extent of ion exchange upon chemical strengthening and chemically strengthening the ion implantation treated glass substrate. The parameters of the ion implantation are chosen such that a controlled curvature is obtained upon chemical strengthening.
摘要:
15 Abstract PANEL OF LAMINATED SUBSTRATES WITH BARRIER LAYER The invention relates to a panel (10) of laminated substrates, comprising a first substrate (12), a conductive layer (14), wherein the conductive layer (14) is provided on the first substrate (12), a second substrate (22), wherein the first substrate (12) and the second substrate (22) are laminated together via a plastics interlayer (20), a light emitting diode (16) inserted between the first substrate (12) and the second substrate 5 (22) being in contact with the conductive layer (14), and a barrier layer (18) preventing a migration of particles from the plastics interlayer (20) to the light emitting diode (16). (Fig. 1)