Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
    1.
    发明公开
    Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool 失效
    基于优先级用于治疗在一个多腔室装置的磁盘的用于处理半导体晶片进行规划的方法和设备

    公开(公告)号:EP0837494A2

    公开(公告)日:1998-04-22

    申请号:EP97307371.1

    申请日:1997-09-22

    发明人: Jevtic, Dusan

    IPC分类号: H01L21/00

    摘要: Apparatus and concomitant method for performing priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing system (100) (cluster tool). The sequences (136) assigns priority values to the chambers (104,106,108,110) in a cluster tool, then moves wafers from chamber to chamber in accordance with the assigned priorities. The sequencer is capable of determining the amount of time available before a priority move is to be performed and, if time is sufficient, the sequencer performs a non-priority move while waiting. The sequencer also dynamically varies assigned priorities depending upon the availability of chambers in the tool. Lastly, the sequencer prioritizes the chambers based upon the minimum time required for the robot to move the wafers in a particular stage.

    摘要翻译: 装置和用于多腔室的半导体晶片处理系统(100)(群集工具)内执行的晶片处理的伴随基于优先级的调度方法。 序列(136)分配的优先级值到在群集工具的腔室(104106108110),然后移动晶片从腔室到腔室中雅舞的分配的优先级。 定序器能够确定开采的前一优先权移动可用的时间量将被执行,并且如果时间是足够的,而在等待定序器执行非优先移动。 定序因此动态地分配的优先级的变化取决于在工具室的可用性。 最后,定序优先基于移动晶片中的特定阶段所需的机器人的最小时间的腔室。