Abstract:
The present invention provides a polyamide resin composition comprising (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid, wherein the content of the component (B) is 0.03 to 20 parts by mass based on 100 parts by mass in total of the component (A) and the component (C3), and the components (C1) to (C3) have following respective contents when selected: component (C1): 0.001 to 0.05 part by mass in terms of the amount of the metal element, component (C2): 0.8 to 20 parts by mass, and component (C3): 1 to 50 parts by mass.
Abstract:
The polyamide resin composition of the present invention comprises a polyamide resin, (B) 0.5 to 400 mmol of a phosphorus compound in terms of a phosphorus element concentration, and (C) 0.5 to 400 mmol of a metal element, per kg of the polyamide resin, wherein the content of an apatite-based compound is 0.3 parts by mass or smaller based on 100 parts by mass of the polyamide resin, and the viscosity number [VN] of the polyamide resin is 160 mL/g or higher.
Abstract:
The present invention provides a polyamide resin composition comprising (A) a polyamide resin, (B) an aluminic acid metal salt, and (C) an organic acid, wherein the content of the aluminic acid metal salt (B) is larger than 0.6 parts by mass based on 100 parts by mass of the polyamide resin (A).