公开(公告)号：EP4415036A1

公开(公告)日：2024-08-14

申请号：EP24155750.3

申请日：2024-02-05

申请人： ASMPT Singapore Pte. Ltd.

发明人： Kai Siu, LAM ,  Nim Tak, WONG ,  Xiaodong, CHEN ,  Kui Kam, LAM

IPC分类号： H01L23/00

CPC分类号： H01L24/743 ,  H01L2224/2731220130101 ,  H01L2224/7561120130101 ,  H01L2224/74320130101 ,  H01L24/83

摘要： An apparatus for applying an adhesive fluid onto a bonding surface during a bonding process includes a positioning table, a dispensing device, a stamping device and a switching member which are mounted on the positioning table. The dispensing device is configured to be positionable by the positioning table to dispense the adhesive fluid onto the bonding surface. The stamping device is configured to be positionable by the positioning table to stamp the adhesive fluid onto the bonding surface. The dispensing device and stamping device are operative to apply the adhesive fluid onto different bonding positions on the bonding surface. The switching member coupled to the stamping device is configured to move the stamping device to a first standby position when the dispensing device is dispensing the adhesive fluid and to a second standby position when the stamping device is stamping the adhesive fluid.