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    Temporary connections for fast electrical access to electronic devices
    2.
    发明公开
    Temporary connections for fast electrical access to electronic devices 失效
    Verbindungen zum schnellen Zugang zu elektronischen Anordnungen。

    公开(公告)号：EP0577333A1

    公开(公告)日：1994-01-05

    申请号：EP93304934.8

    申请日：1993-06-24

    申请人： AT&T Corp.

    发明人： Frye, Robert Charles ,  Lau, Maureen Yee ,  Tai, King Lien

    IPC分类号： G01R1/067 ,  G01R1/073

    CPC分类号： H05K3/325 ,  G01R1/06738 ,  G01R1/07307 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A given testing substrate (20) for fast-testing many integrated-circuit electronic devices (e.g., 10), one after the other, has a set of mutually insulated corrugated wiring areas (30) that can be aligned with solder-bump I/O pads (13) of the electronic devices. At the surface of each of the corrugated areas is located a layer (23) that is an electrically conductive durable oxide, or that is itself durable, electrically conductive, and non-oxidizable. During testing, the solder-bump I/O pads of the electronic device being tested are aligned with and pressed against the corrugated wiring areas of the given substrate.
    Alternatively, the electronic devices being of the electrically programmable variety, such as EPROMS, programming voltages can be delivered to each of the devices, one after the other, through the corrugated wiring areas of a single substrate.

    摘要翻译： 用于快速测试许多集成电路电子设备（例如10）的给定测试基板（20）一个接一个地具有一组相互隔离的波纹布线区域（30），其可以与焊料凸块I / O垫片（13）。 在每个波纹区域的表面上设置有导电耐久氧化物的层（23），或者其本身是耐用的，导电的和不可氧化的。 在测试期间，正在测试的电子设备的焊料凸块I / O焊盘与给定衬底的波纹布线区域对准并压紧。 或者，可以通过单个基板的波纹布线区域将电气可编程品种的诸如EPROMS的编程电压的电子装置一个接一个地传送到每个装置。