公开(公告)号：EP4252986A1

公开(公告)日：2023-10-04

申请号：EP22166241.4

申请日：2022-04-01

申请人： Adamcio, Andrzej

发明人： Adamcio, Andrzej ,  Rydzkowski, Tomasz ,  Borecki, Dariusz ,  Sobczyk, Marcin ,  Wilczy ska, Anna ,  Wilczy ski, Wojciech ,  Mirski, Rados aw

IPC分类号： B27N1/00 ,  B27N3/00 ,  B27N3/02

摘要： The chipboard consisting of organic particles of a synthetic resin composite, characterised in that it contains from 10 to 60% by weight of grounded composite, from 5 to 60% by weight of synthetic resin and from 10 to 85% by weight of organic particles, in particular wood and vegetable particles or fibres or compositions of these components. The object of the invention is also a method for manufacturing chipboard.