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公开(公告)号:EP2426190A1
公开(公告)日:2012-03-07
申请号:EP10769733.6
申请日:2010-04-27
申请人: Akros Co., Ltd.
发明人: MAKINO Shin , MIYAMOTO Keisuke , MATSUO Shoko
IPC分类号: C10M169/04 , C10M107/44 , C10M125/02 , C10M125/10 , C10M125/22 , C10M147/02 , C10N20/00 , C10N20/06 , C10N30/06 , C10N40/25 , C10N50/02
CPC分类号: C10M125/00 , C10M141/00 , C10M2201/041 , C10M2201/05 , C10M2201/062 , C10M2201/065 , C10M2201/066 , C10M2209/1003 , C10M2213/062 , C10M2217/0443 , C10M2221/0405 , C10N2220/082 , C10N2230/06 , C10N2250/141
摘要: There is provided a sliding member coating composition for forming a coating on the surface of a sliding member, which contains a binder resin, abrasion inhibiting members, and a solid lubricant as needed. The shape of the abrasion inhibiting members is a panel shape having an aspect ratio of 5 to 100 expressed by average particle diameter/average particle thickness, and has an average particle diamter of 15. 0 µm or smaller and a Moh's hardness of 6 or higher. The content of the solid lubricant can be set to 0 to 15 parts by weight with respect to 100 parts by weight of the binder resin, and the content of the abrasion inhibiting members to 1 to 100 parts by weight with respect to 100 parts by weight of the binder resin. The solid lubricant may not be blended. The abrasion inhibiting members are preferably aluminas. According to the sliding member coating composition in the present invention, even when being exposed to severe frictional conditions for a long time, preferable lubricity can be guaranteed.
摘要翻译: 提供了一种用于在滑动构件的表面上形成涂层的滑动构件涂料组合物,其包含粘合剂树脂,耐磨损构件和根据需要的固体润滑剂。 耐磨损构件的形状是具有平均粒径/平均粒子厚度的纵横比为5〜100的面板形状,平均粒径为15μm以下,莫氏硬度为6以上 。 相对于100重量份粘合剂树脂,固体润滑剂的含量可以设定为0〜15重量份,耐磨损剂的含量相对于100重量份为1〜100重量份 的粘合剂树脂。 固体润滑剂不能混合。 耐磨损构件优选为氧化铝。 根据本发明的滑动部件涂料组合物,即使长时间暴露于严重的摩擦条件下,也可以保证优选的润滑性。
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公开(公告)号:EP3611758A1
公开(公告)日:2020-02-19
申请号:EP18784515.1
申请日:2018-03-19
IPC分类号: H01L21/304 , B24B37/30 , H01L21/683
摘要: A wafer-retaining elastic film (10) of a CMP device includes: a film body (11) comprised of an elastic material; and a coating layer (12) formed so as to cover the surface on the wafer retaining side of the film body (11). The coating layer (12) contains a polymeric binder and nonmetallic particles dispersed in the polymeric binder.
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