公开(公告)号：EP3420710A1

公开(公告)日：2019-01-02

申请号：EP17749239.4

申请日：2017-07-11

申请人： Apple Inc.

发明人： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC分类号： H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

公开(公告)号：EP3956941A1

公开(公告)日：2022-02-23

申请号：EP20722982.4

申请日：2020-04-16

申请人： Apple Inc.

发明人： PERKINS, Ryan C. ,  SANO, Tatsuya ,  WALTON, Christopher J. ,  WANG, Erik L. ,  WERNER, Christopher M. ,  ASHCROFT, Anthony M. ,  DE JONG, Erik G. ,  HUNTER, Tirshathah A. ,  KIM, Seul Bi ,  CROSBY, Justin D. ,  JUNG, Woojin ,  SCHAEVITZ, Samuel B. ,  AVENDAL, Johan ,  DA COSTA BRAS LIMA, Eduardo Jorge ,  DI NALLO, Carlo ,  NATH, Jayesh ,  PAPANTONIS, Dimitrios ,  GRAHAM, Christopher S. ,  THOMPSON, Paul J. ,  COPELAND, Devon K. ,  ELY, Colin M.

IPC分类号： H01Q1/22 ,  H01Q3/26 ,  G01S3/14 ,  G01S5/02 ,  H04W4/029 ,  H01Q1/38 ,  H01Q21/30 ,  H01Q1/24 ,  G08B13/24 ,  E05B73/00

公开(公告)号：EP3454413A1

公开(公告)日：2019-03-13

申请号：EP18191231.2

申请日：2018-08-28

申请人： Apple Inc.

发明人： PANDYA, Sameer ,  MARTINIS, Mario ,  OZGEN, Baris ,  BUSHNELL, Tyler S. ,  TANG, Sherry ,  YANG, Henry H. ,  WERNER, Christopher M. ,  NATH, Jayesh ,  DI NALLO, Carlo ,  RUARO, Andrea

IPC分类号： H01Q1/24 ,  H01Q1/27 ,  G04R60/12

摘要： Aspects of the subject technology relate to electronic devices with antennas. The antenna may be a display-integrated antenna. An antenna feed for the antenna may be located in a recess in a sidewall of a housing of the device. The antenna feed may be coupled to transceiver circuitry on a logic board of the device by a pair of flex circuits. A first one of the pair of flex circuits may form a portion of an antenna feed assembly. A second one of the pair of flex circuits may be an impedance-matching flex having an end that is soldered to the main logic board. The antenna may be coupled to a conductive portion of the housing of the device.