公开(公告)号：EP4166918A3

公开(公告)日：2023-06-28

申请号：EP22197505.5

申请日：2022-09-23

申请人： Apple Inc.

发明人： TADELE, Wegene H. ,  KARAKI, Habib S. ,  CLEMENTS, James C. ,  HOANG, Lan Hoang ,  ZHANG, Leilei ,  KO, Jacky G. ,  HAIDRI, Jafir A. ,  CHU, Xinsheng ,  MEHRA, Saahil ,  TANG, Sherry ,  BUCHHOLZ, Jeffrey W. ,  HAN, Chin San ,  D'SOUZA, Craig C. ,  LABOVE, Daniel W. ,  CHEN, Esther ,  LEE, Joseph R. ,  HUANG,Kuo Jen ,  HUANG, Wanfeng ,  CHOU, Fred Y. ,  CHEN, Hongling ,  AMIN, Ali M. ,  LIN, Chia-Hsien

IPC分类号： G01K3/14 ,  G01K1/16 ,  G01K13/20 ,  G01K7/02 ,  G01K17/00 ,  A61B5/00 ,  A61B5/01 ,  G01K7/42 ,  H05K1/18

摘要： Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.

公开(公告)号：EP4166918A2

公开(公告)日：2023-04-19

申请号：EP22197505.5

申请日：2022-09-23

申请人： Apple Inc.

发明人： TADELE, Wegene H. ,  KARAKI, Habib S. ,  CLEMENTS, James C. ,  HOANG, Lan Hoang ,  ZHANG, Leilei ,  KO, Jacky G. ,  HAIDRI, Jafir A. ,  CHU, Xinsheng ,  MEHRA, Saahil ,  TANG, Sherry ,  BUCHHOLZ, Jeffrey W. ,  HAN, Chin San ,  D'SOUZA, Craig C. ,  LABOVE, Daniel W. ,  CHEN, Esther ,  LEE, Joseph R. ,  HUANG,Kuo Jen ,  HUANG, Wanfeng ,  CHOU, Fred Y. ,  CHEN, Hongling ,  AMIN, Ali M. ,  LIN, Chia-Hsien

IPC分类号： G01K3/14 ,  G01K1/16 ,  G01K13/20 ,  G01K7/02 ,  G01K17/00 ,  A61B5/00 ,  A61B5/01 ,  G01K7/42 ,  H05K1/18

摘要： Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.