公开(公告)号：EP4407968A1

公开(公告)日：2024-07-31

申请号：EP24154036.8

申请日：2024-01-25

申请人： Apple Inc.

发明人： KOCH, Richard H. ,  ZHONG, Chen ,  LASHINSKY, Matthew A. ,  ZIN, Bryan ,  JARVIS, Daniel W. ,  SHANNON, Jason P. ,  RAMMAH, Marwan ,  JAY, Hugh J.

IPC分类号： H04M1/02

CPC分类号： H04M1/0266 ,  H04M1/0202 ,  H04M1/026

摘要： A portable electronic device may include a housing component defining a side exterior surface of the portable electronic device and a front cover assembly coupled to the housing component and including a front cover defining a front exterior surface of the portable electronic device and an interior surface opposite to the front exterior surface, a display stack attached to the interior surface of the front cover, a support frame coupled to the display stack and defining a plurality of engagement features, and a molded frame member coupled to the interior surface of the front cover and extending at least partially around a periphery of the display stack, the molded frame member encapsulating at least a portion of the support frame and engaging the plurality of engagement features.

公开(公告)号：EP4064662A2

公开(公告)日：2022-09-28

申请号：EP22158555.7

申请日：2022-02-24

申请人： Apple Inc.

发明人： ZHANG, Xuyang ,  SHANNON, Jason P. ,  HOUSOUR, Jon F. ,  MEYER, Robert F. ,  HALE, Owen D. ,  MORGAN, Dale T. ,  JARVIS, Daniel ,  MERZ, Nicholas ,  MORSE, Benjamin ,  PHOUTHAVONG, Rasamy ,  WITTENBERG, Michael B. ,  PAKULA, David A. ,  HELMORE, Simon C. ,  ROSE, Gareth L. ,  RAMMAH, Marwan ,  WAH, Melissa A. ,  BARTON, Jacob ,  SPRAGGS, Ian A.

IPC分类号： H04M1/02

摘要： A portable electronic device (100) includes a housing (104), a touch-sensitive display at least partially within the housing, a sensor array (134) including a first camera module (138) having a first field of view, a second camera module (139) having a second field of view different from the first field of view, and a light source (136), and a rear cover (132) formed from a glass material and defining a raised sensor array region positioned over the sensor array (132). The raised sensor array region defines a first hole extending through the rear cover (132) and positioned proximate a first corner region of the raised sensor array region, and a second hole extending through the rear cover (132) and positioned proximate a second corner region diagonal from the first corner region. The first camera module (138) includes a first camera housing defining a recess at a corner of the first camera housing, and the second camera module (139) includes a second camera housing extending into the recess.

公开(公告)号：EP4344178A3

公开(公告)日：2024-06-19

申请号：EP24156666.0

申请日：2020-04-14

申请人： Apple Inc.

发明人： MEYER, Robert F. ,  COUNTS, William A. ,  QUINONES, Michael D. ,  SHANNON, Jason P. ,  PAKULA, David A.

IPC分类号： G06F1/16 ,  G06F1/20 ,  H04M1/02

CPC分类号： G06F1/203 ,  H04M1/026 ,  G06F1/1658

摘要： An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.

公开(公告)号：EP4407966A1

公开(公告)日：2024-07-31

申请号：EP24154032.7

申请日：2024-01-25

申请人： Apple Inc.

发明人： HOUSOUR, Jon F. ,  DADE, Macey E. ,  GRAY, Benjamin R. ,  SHALAN, Reema ,  JARVIS, Daniel W. ,  SHANNON, Jason P. ,  RAMMAH, Marwan ,  MEYER, Robert F. ,  KOCH, Richard H. ,  HOOTON, Lee E. ,  TOMASETTA, Christopher S.

IPC分类号： H04M1/02

CPC分类号： H04M1/0202 ,  H04M1/0266 ,  H04M1/026

摘要： A mobile phone may include a housing. The housing may include a first housing component including a cladding portion formed from a first metal and defining a first portion of a side exterior surface of the mobile phone, and a core portion coupled to the cladding portion, the core portion defining a portion of an interior surface of the mobile phone and formed from a second metal different from the first metal, a second housing component defining a second portion of the side exterior surface of the mobile phone, and a joint structure coupled to the first housing component and the second housing component and defining a third portion of the side exterior surface of the mobile phone between the first portion of the side exterior surface and the second portion of the side exterior surface. The cladding portion may be bonded directly to the core portion.

公开(公告)号：EP4407965A1

公开(公告)日：2024-07-31

申请号：EP24153996.4

申请日：2024-01-25

申请人： Apple Inc.

发明人： HOUSOUR, Jon F. ,  DADE, Macey E. ,  GRAY, Benjamin R. ,  SHALAN, Reema ,  JARVIS, Daniel W. ,  SHANNON, Jason P. ,  RAMMAH, Marwan ,  MEYER, Robert F. ,  KOCH, Richard H. ,  SINCLAIR, Anthony B. ,  ROSE, Gareth L.

IPC分类号： H04M1/02

CPC分类号： H04M1/0264 ,  H04M1/026 ,  H04M1/0262 ,  H04M1/0266 ,  H04M1/0202

摘要： A mobile phone may include an enclosure including a front cover assembly defining a front exterior surface of the enclosure, a rear cover assembly defining a rear exterior surface of the enclosure, and a housing subassembly positioned between the front cover assembly and the rear cover assembly. The housing subassembly may include a first housing component defining a first side exterior surface of the enclosure, a second housing component defining a second side exterior surface of the enclosure opposite the first side exterior surface of the enclosure, and a lower chassis section extending between the first housing component and the second housing component. The mobile phone may further include a camera array coupled to the lower chassis section and positioned in an interior cavity defined between the lower chassis section and the front cover assembly.

公开(公告)号：EP4407415A1

公开(公告)日：2024-07-31

申请号：EP24154037.6

申请日：2024-01-25

申请人： Apple Inc.

发明人： SCHOENSEE, Shayla A. ,  BARTON, Jacob ,  CHUNG, Kevin Y. ,  JARVIS, Daniel W. ,  SHANNON, Jason P. ,  RAMMAH, Marwan

IPC分类号： G06F3/01 ,  H04M1/23 ,  H04M1/02 ,  H04M1/72448

CPC分类号： H04M1/236 ,  H04M1/72448 ,  H04M1/0264 ,  H04M2250/1220130101 ,  G06F3/016

摘要： A mobile phone may include an enclosure defining a front exterior surface of the mobile phone, a rear exterior surface of the mobile phone, and a side exterior surface of the mobile phone. The mobile phone may further include an audio output system configured to produce an audible alert in response to the mobile phone receiving an incoming call, a momentary ringer-control button positioned along a side exterior surface of the housing component, and a processing system configured to, in response to detecting an actuation of the momentary ringer-control button while a first ringer mode of the mobile phone is active, transition the mobile phone to a second ringer mode, and in response to detecting the actuation of the momentary ringer-control button while a second ringer mode of the mobile phone is active, transition the mobile phone to the first ringer mode.

公开(公告)号：EP4344178A2

公开(公告)日：2024-03-27

申请号：EP24156666.0

申请日：2020-04-14

申请人： Apple Inc.

发明人： MEYER, Robert F. ,  COUNTS, William A. ,  QUINONES, Michael D. ,  SHANNON, Jason P. ,  PAKULA, David A.

IPC分类号： H04M1/02

摘要： An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.

公开(公告)号：EP4064662A3

公开(公告)日：2022-12-28

申请号：EP22158555.7

申请日：2022-02-24

申请人： Apple Inc.

发明人： ZHANG, Xuyang ,  SHANNON, Jason P. ,  HOUSOUR, Jon F. ,  MEYER, Robert F. ,  HALE, Owen D. ,  MORGAN, Dale T. ,  JARVIS, Daniel ,  MERZ, Nicholas ,  MORSE, Benjamin ,  PHOUTHAVONG, Rasamy ,  WITTENBERG, Michael B. ,  PAKULA, David A. ,  HELMORE, Simon C. ,  ROSE, Gareth L. ,  RAMMAH, Marwan ,  WAH, Melissa A. ,  BARTON, Jacob ,  SPRAGGS, Ian A.

IPC分类号： H04M1/02

摘要： A portable electronic device (100) includes a housing (104), a touch-sensitive display at least partially within the housing, a sensor array (134) including a first camera module (138) having a first field of view, a second camera module (139) having a second field of view different from the first field of view, and a light source (136), and a rear cover (132) formed from a glass material and defining a raised sensor array region positioned over the sensor array (132). The raised sensor array region defines a first hole extending through the rear cover (132) and positioned proximate a first corner region of the raised sensor array region, and a second hole extending through the rear cover (132) and positioned proximate a second corner region diagonal from the first corner region. The first camera module (138) includes a first camera housing defining a recess at a corner of the first camera housing, and the second camera module (139) includes a second camera housing extending into the recess.

公开(公告)号：EP3726335A1

公开(公告)日：2020-10-21

申请号：EP20169491.6

申请日：2020-04-14

申请人： Apple Inc.

发明人： MEYER, Robert F. ,  COUNTS, William A. ,  QUINONES, Michael D. ,  SHANNON, Jason P. ,  PAKULA, David A.

IPC分类号： G06F1/16 ,  G06F1/20 ,  H04M1/02

摘要： An electronic device (100) can include a housing and a support component (130) joined to the housing. The support component (130) can include a thermal conduction layer (135) defining a first surface and a second surface opposite the first surface. The support component (130) can also include a first support layer (131) overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer (135) to the combined thickness of the first support layer (131) and the second support layer can be at least 1.5.