公开(公告)号：EP2524763A1

公开(公告)日：2012-11-21

申请号：EP10835925.8

申请日：2010-12-06

申请人： Arakawa Chemical Industries, Ltd. ,  Toyota Jidosha Kabushiki Kaisha ,  Denso Corporation ,  Fujitsu Ten Limited ,  Koki Company Limited ,  Harima Chemicals, Inc.

发明人： IWAMURA, Eiji ,  GOTOH, Kazushi ,  ISHIGA, Fumio ,  YOSHIOKA, Takayasu ,  UTSUNO, Masayoshi ,  NAKAMURA, Atsuo ,  OKOCHI, Teruo ,  SANJI, Masaki ,  SUKEKAWA, Takuji ,  IKEDO, Kenshi ,  ANDOH, Yoshiyuki ,  SHIRAI, Takeshi ,  MORI, Kimiaki ,  WADA, Rie ,  NAKANISHI, Kensuke ,  AIHARA, Masami ,  KUMAMOTO, Seishi

IPC分类号： B23K35/363 ,  H05K3/34 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00

CPC分类号： B23K35/3613 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  H05K3/3484

摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

摘要翻译： 公开了一种焊膏，其在焊剂内包含具有分子量不超过250的二元酸，分子量在150至300的一元酸的活化剂和具有 分子量在300至600的范围内; 和至少一种选自包括高密度聚乙烯和聚丙烯的树脂添加剂。 焊膏在助焊剂内的4质量％〜12质量％的树脂添加剂的范围内，焊膏在80℃下的粘度为400Pa·s以上。

公开(公告)号：EP2511043A1

公开(公告)日：2012-10-17

申请号：EP10835926.6

申请日：2010-12-06

申请人： Arakawa Chemical Industries, Ltd. ,  Toyota Jidosha Kabushiki Kaisha ,  Denso Corporation ,  Fujitsu Ten Limited ,  Koki Company Limited ,  Harima Chemicals, Inc.

发明人： IWAMURA, Eiji ,  GOTOH, Kazushi ,  NAGASAKA, Shinsuke ,  YOSHIOKA, Takayasu ,  UTSUNO, Masayoshi ,  NAKAMURA, Atsuo ,  OKOCHI, Teruo ,  SANJI, Masaki ,  SUKEKAWA, Takuji ,  IKEDO, Kenshi ,  ANDOH, Yoshiyuki ,  SHIRAI, Takeshi ,  MORI, Kimiaki ,  WADA, Rie ,  NAKANISHI, Kensuke ,  AIHARA, Masami ,  KUMAMOTO, Seishi

IPC分类号： B23K35/363 ,  B23K35/26 ,  C22C13/00

CPC分类号： B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

摘要翻译： 公开了即使在通过丝网印刷法等反复施加剪切力之后也具有足够的流动性的焊膏。 具体公开了一种用于焊膏的焊剂，其包含：通过使具有C 6 -C 15烷基的（甲基）丙烯酸酯和除上述以外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸树脂 （甲基）丙烯酸酯; 和松香。 当松香的重量为1时，丙烯酸树脂的重量比为0.5-1.2（含），通过施加10-150Pa（含）的剪切力使焊膏的焊剂流动， 。

公开(公告)号：EP2511043B1

公开(公告)日：2018-07-11

申请号：EP10835926.6

申请日：2010-12-06

申请人： Arakawa Chemical Industries, Ltd. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  Denso Corporation ,  Fujitsu Ten Limited ,  Koki Company Limited ,  Harima Chemicals, Inc.

发明人： IWAMURA, Eiji ,  GOTOH, Kazushi ,  NAGASAKA, Shinsuke ,  YOSHIOKA, Takayasu ,  UTSUNO, Masayoshi ,  NAKAMURA, Atsuo ,  OKOCHI, Teruo ,  SANJI, Masaki ,  SUKEKAWA, Takuji ,  IKEDO, Kenshi ,  ANDOH, Yoshiyuki ,  SHIRAI, Takeshi ,  MORI, Kimiaki ,  WADA, Rie ,  NAKANISHI, Kensuke ,  AIHARA, Masami ,  KUMAMOTO, Seishi

IPC分类号： H05K3/34 ,  B23K35/36 ,  B23K35/362 ,  C22C13/00 ,  B23K35/02

CPC分类号： B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

公开(公告)号：EP2524763B1

公开(公告)日：2018-12-05

申请号：EP10835925.8

申请日：2010-12-06

申请人： Arakawa Chemical Industries, Ltd. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  Denso Corporation ,  DENSO TEN Limited ,  Koki Company Limited ,  Harima Chemicals, Inc.

发明人： IWAMURA, Eiji ,  GOTOH, Kazushi ,  ISHIGA, Fumio ,  YOSHIOKA, Takayasu ,  UTSUNO, Masayoshi ,  NAKAMURA, Atsuo ,  OKOCHI, Teruo ,  SANJI, Masaki ,  SUKEKAWA, Takuji ,  IKEDO, Kenshi ,  ANDOH, Yoshiyuki ,  SHIRAI, Takeshi ,  MORI, Kimiaki ,  WADA, Rie ,  NAKANISHI, Kensuke ,  AIHARA, Masami ,  KUMAMOTO, Seishi

IPC分类号： B23K35/36 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  H05K3/34

CPC分类号： B23K35/3613 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  H05K3/3484

摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.