COMPOUNDED UNSATURATED POLYESTER RESIN COMPOSITIONS WITH A REDUCED MONOMER CONTENT
    2.
    发明授权
    COMPOUNDED UNSATURATED POLYESTER RESIN COMPOSITIONS WITH A REDUCED MONOMER CONTENT 无效
    公顷DEVICES的不饱和聚酯树脂波WITH REDUCED单体

    公开(公告)号:EP1149131B1

    公开(公告)日:2004-12-22

    申请号:EP99952668.4

    申请日:1999-10-19

    申请人: Ashland Inc.

    IPC分类号: C08L67/06

    CPC分类号: C08L67/06 Y10T428/31794

    摘要: The invention relates to unsaturated polyester resins and more particularly to compounded unsaturated polyester resin compositions with reduced monomer content comprising at least two different types of unsaturated polyesters. The invention also relates to a method for the manufacture of such unsaturated polyester resins and compounded resin compositions and to the use thereof. The compounded unsaturated polyester resin compositions comprise 10-90 wt% of at least one high viscosity, high molecular weight unsaturated polyester, 10-80 wt% of at least one low viscosity, low molecular weight unsaturated polyester and 9-30 % of at least one monomer.

    UNSATURATED POLYESTER RESIN AND THE USE OF IT
    3.
    发明授权
    UNSATURATED POLYESTER RESIN AND THE USE OF IT 有权
    不饱和聚酯树脂和它们的使用

    公开(公告)号:EP1124877B1

    公开(公告)日:2005-04-20

    申请号:EP99969726.1

    申请日:1999-09-29

    申请人: Ashland Inc.

    摘要: The invention relates unsaturated polyester resins for the manufacture of subzero flexible, weather-resistant products. The liquid unsaturated polyester resin comprises a linear unsaturated polyester obtained by reacting 5-30 mol% of one or more ethylenically unsaturated dicarboxylic acids (A), 20-45 mol% of one or more other aliphatic or aromatic acids (B) and 40-60 mol% of two or more polyhydric alcohols and 30-60 wt% of one or more reactive monomers. The linear unsaturated polyesters have a cone and plate viscosity (I.C.I.) of 2 ps/125 °C - 20 ps/125 °C and a molecular weight Mw of 20.000 - 100.000. The invention also relates to a process for the manufacture of such unsaturated polyester resins and to the use of them in applications wherein good adhesion to supporting material and flexibility at ambient and especially at low temperatures are needed.