公开(公告)号：EP1092790A2

公开(公告)日：2001-04-18

申请号：EP00309095.8

申请日：2000-10-16

申请人： Atofina Chemicals, Inc.

发明人： Martyak, Nicholas M. ,  Gernon, Michael D. ,  Janney, Patrick

IPC分类号： C25D3/38

CPC分类号： C25D7/123 ,  C25D3/38

摘要： Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or submicron dimensioned trenches or vias.

摘要翻译： 公开了一种用于将铜电沉积到电子器件衬底上的改进的电解质配方以及使用该配方的工艺。 该配方是一种含有链烷磺酸铜盐和游离烷烃磺酸的溶液，用于微米或亚微米尺寸的沟槽或过孔的金属化。

公开(公告)号：EP1092790A3

公开(公告)日：2002-09-11

申请号：EP00309095.8

申请日：2000-10-16

申请人： Atofina Chemicals, Inc.

发明人： Martyak, Nicholas M. ,  Gernon, Michael D. ,  Janney, Patrick

IPC分类号： C25D3/38 ,  C25D7/12

CPC分类号： C25D7/123 ,  C25D3/38

摘要： Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or submicron dimensioned trenches or vias.