公开(公告)号：EP1909128A1

公开(公告)日：2008-04-09

申请号：EP07117880.0

申请日：2007-10-04

申请人： Avanex Corporation

发明人： Galeotti, Roberto ,  Gobbi, Luigi ,  Bonazzoli, Mario

IPC分类号： G02B6/42

CPC分类号： G02B6/4248 ,  G02B6/4201 ,  G02B6/4251 ,  G02B6/4256 ,  G02B6/4279 ,  H05K5/069

摘要： The present invention generally relates to an air cavity plastic package (100) for a high frequency optical device. In one aspect, a module package (100) for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing (125) having an upper cavity (130) formed therein and a lower plastic housing (150) having a lower cavity (155) formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors (160,180) disposed in the lower housing, each conductor having an upper end (160B,180B) and a lower end (160A,180A), wherein the upper end is connectable to a chip (105) disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided. In yet another aspect, a package assembly for an electro-optical modulator is provided.

摘要翻译： 本发明一般涉及一种用于高频光学装置的空气腔塑料封装（100）。 一方面，提供了一种用于高频光电子器件的模块封装（100）。 模块封装包括具有形成在其中的上空腔（130）的上塑料外壳（125）和在其中形成有下空腔（155）的下塑料外壳（150）。 上壳体和下壳体构造成配合在一起，使得空腔在壳体之间形成封闭的空气腔。 此外，在壳体之间创建密封件时，实现了光学馈通。 所述模块封装还包括设置在所述下壳体中的多个导体（160,180），每个导体具有上端（160B，180B）和下端（160A，180A），其中所述上端可连接到芯片 ），并且下端可连接到电路板。 另一方面，提供了一种封装和组装高频光学器件的方法。 在另一方面，提供了一种用于电光调制器的封装组件。

公开(公告)号：EP2113806A1

公开(公告)日：2009-11-04

申请号：EP09154731.5

申请日：2009-03-10

申请人： Avanex Corporation

发明人： Galeotti, Roberto ,  Gobbi, Luigi ,  Bonazzoli, Mario

IPC分类号： G02F1/035 ,  G02B6/42

CPC分类号： G02F1/0305 ,  G02F1/0356 ,  G02F1/2255 ,  G02F1/313

摘要： A package design for electro-optic devices has been developed in which the substrate (21) supporting the electro-optic element (11) serves also as the base of the device housing (31). The electro-optic element may be flip-chip bonded to the substrate. In a preferred embodiment the substrate (21) is a multi-level wiring board.