公开(公告)号：EP1646690A1

公开(公告)日：2006-04-19

申请号：EP04740843.0

申请日：2004-07-09

申请人： BASF Aktiengesellschaft

发明人： HESSE, Günter ,  NEUHAUS, Ralf ,  REINFRANK, Karl-Michael ,  KROISS, Robert ,  SCHOBEL, Gunter ,  GUTTING, Wolfgang ,  USKE, Klaus ,  SZENDRO, Mark

IPC分类号： C08L77/00 ,  C08K5/00 ,  C08K5/3492

CPC分类号： C08K5/34928 ,  Y10T428/1352 ,  Y10T428/1372 ,  Y10T428/1397 ,  C08L77/00

摘要： The invention relates to a housing shell for an electronic device. Said housing shell is produced from a heat-resistant, flame-resistant, thermoplastic material in an injection molding method. The thermoplastic material used is a halogen-free flame-resistant polyamide-based plastic.