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    Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
    1.
    发明公开
    Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films 审中-公开
    用于基材的与电介质的氧化硅和多晶硅膜的化学机械抛光的水性抛光组合物和方法

    公开(公告)号：EP2428541A1

    公开(公告)日：2012-03-14

    申请号：EP11179985.4

    申请日：2011-09-05

    申请人： BASF SE

    发明人： Li, Yuzhuo ,  Chu, Jea-Ju ,  Venkataraman, Shyam Sundar ,  Chiu, Wei Lan William ,  Pinder, Harvey Wayne

    IPC分类号： C09K3/14 ,  C09G1/02

    CPC分类号： C09K13/00 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

    摘要： An aqueous polishing composition has been found, the said aqueous polishing composition comprising
    (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility;
    (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and
    (C) at least one anionic phosphate dispersing agent;

    and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.

    摘要翻译： 在wässrige抛光组合物，已经发现，所述的wässrige在3的范围内的抛光组合物，包括（A）至少一种类型的具有正电荷的当wässrige介质不含组分（B）分散在磨粒且pH 9如由电泳迁移率; （B）选自直链和支化的亚烷基氧化物共聚物和均聚物的至少一种水溶性聚合物; 和（C）至少一种分散剂阴离子磷酸盐; 和用于抛光基片的材料用于利用wässrige抛光组合物的电气，机械和光学器件的方法。