PATTERNING NANOWIRES ON SURFACES FOR FABRICATING NANOSCALE ELECTRONIC DEVICES
    1.
    发明公开
    PATTERNING NANOWIRES ON SURFACES FOR FABRICATING NANOSCALE ELECTRONIC DEVICES 审中-公开
    电子元器件剂在纳米尺度产区纳米线结构

    公开(公告)号:EP2022107A2

    公开(公告)日:2009-02-11

    申请号:EP07729241.5

    申请日:2007-05-16

    IPC分类号: H01L51/10

    摘要: The present invention relates to a method of depositing nanowires on the surface of a substrate, comprising the steps of: contacting defined regions of the substrate with at least one compound (C1) capable of binding to the surface of the substrate and of binding the nanowires to provide a pattern of binding sites on the surface of the substrate and/or contacting defined regions of the substrate with at least one compound (C2) capable of binding to the surface of the substrate and preventing the binding of nanowires to provide a pattern of non-binding sites on the surface of the substrate, and contacting the surface of the substrate with a suspension of nanowires in a liquid medium to enable at least a portion of the applied nanowires to bind to at least a portion of the surface of the substrate covered with (C1) and/or not covered with (C2).

    PATTERNING CRYSTALLINE COMPOUNDS ON SURFACES
    2.
    发明公开
    PATTERNING CRYSTALLINE COMPOUNDS ON SURFACES 审中-公开
    结构的结晶组合物曲面的

    公开(公告)号:EP1987552A1

    公开(公告)日:2008-11-05

    申请号:EP07704586.2

    申请日:2007-02-14

    IPC分类号: H01L51/00 H01L51/05

    摘要: A method of patterning the surface of a substrate with at least one organic semiconducting compound, comprising the steps of: (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern, said indentations being contiguous with a stamping surface and defining a stamping pattern, (b) coating said stamping surface with at least one compound (C1) capable of binding to the surface of the substrate and of binding at least one organic semiconducting compound (S), (c) contacting at least a portion of the surface of a substrate with said stamping surface to allow deposition of said compound (C1) on the substrate, (d) removing said stamping surface to provide a pattern of binding sites on the surface of the substrate, (e) applying a plurality of crystallites of the organic semiconducting compound (S) to the surface of the substrate to enable at least a portion of the applied crystallites to bind to at least a portion of the binding sites on the surface of the substrate.