公开(公告)号：EP3412733A1

公开(公告)日：2018-12-12

申请号：EP17747393.1

申请日：2017-01-31

申请人： Bando Chemical Industries, Ltd.

发明人： MUKAI, Fumihiro ,  YAMAURA, Kotaro ,  NAITO, Hiroki ,  SAKO, Yasuhiro

IPC分类号： C08L83/04 ,  C08K3/00 ,  C08L27/12 ,  C08L33/08

CPC分类号： C08K3/00 ,  C08L27/12 ,  C08L33/08 ,  C08L83/04

摘要： Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5W/mK.