AMOLED DRIVE COMPENSATION CIRCUIT AND METHOD AND DISPLAY DEVICE THEREOF
    1.
    发明公开
    AMOLED DRIVE COMPENSATION CIRCUIT AND METHOD AND DISPLAY DEVICE THEREOF 有权
    AMOLED-ANTRIEBSKOMPENSATIONSSCHALTUNG SOWIE VERFAHREN UND ANZEIGEVORRICHTUNGDAFÜR

    公开(公告)号:EP2775474A1

    公开(公告)日:2014-09-10

    申请号:EP12790776.4

    申请日:2012-09-26

    IPC分类号: G09G3/32

    摘要: The present disclosure discloses an AMOLED driving and compensating circuit and method, and AMOLED display device. The driving and compensating circuit comprising: several driving circuits set inside several pixel regions used for driving several AMOLEDs; an external compensating circuit set outside the pixel regions used for eliminating an effect of threshold voltage of a driving thin film transistors in the several driving circuits set inside the several pixel regions on driving currents passing through the driving thin film transistors. The driving and compensating method comprising: storing threshold voltage of the driving thin film transistors of the several driving circuits set inside the several pixel regions; storing grayscale voltage of each of the several driving circuits set inside the several pixel regions; gate voltage of the driving thin film transistor of each of the several driving circuits set inside the several pixel regions jumping to a sum of the threshold voltage and the grayscale voltage of the driving circuit. The display device comprises the AMOLED driving and compensating circuit.

    摘要翻译: 本公开公开了一种AMOLED驱动和补偿电路和方法以及AMOLED显示装置。 驱动和补偿电路包括:几个驱动电路,设置在用于驱动多个AMOLED的几个像素区域内; 设置在像素区域之外的外部补偿电路,用于消除在穿过驱动薄膜晶体管的驱动电流上设置在多个像素区域内的多个驱动电路中的驱动薄膜晶体管的阈值电压的影响。 驱动和补偿方法包括:存储设置在几个像素区域内的多个驱动电路的驱动薄膜晶体管的阈值电压; 存储设置在所述几个像素区域内的所述多个驱动电路中的每一个的灰度电压; 设置在几个像素区域内的多个驱动电路中的每一个的驱动薄膜晶体管的栅极电压跳到阈值电压和驱动电路的灰度电压之和。 显示装置包括AMOLED驱动和补偿电路。

    CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE

    公开(公告)号:EP4394493A1

    公开(公告)日:2024-07-03

    申请号:EP21957142.9

    申请日:2021-09-17

    IPC分类号: G02F1/1345 G09F9/00 H05K1/18

    CPC分类号: H05K1/18 G09F9/00 G02F1/1345

    摘要: A circuit board assembly (100), comprising a first circuit board (1) and at least one second circuit board (2). The first circuit board (1) comprises at least one first binding assembly (11), and the first binding assembly (11) comprises a plurality of first conductive blocks (111) sequentially arranged at intervals in a first direction. The at least one second circuit board (2) comprises at least one second binding assembly (21), and the second binding assembly (21) comprises a plurality of second conductive blocks (211) sequentially arranged at intervals; the plurality of second conductive blocks (211) in one second binding assembly (21) are bound and connected to the plurality of first conductive blocks (111) in one first binding assembly (11) in one-to-one correspondence. The expansion rate of the first circuit board (1) is less than the expansion rate of the second circuit board (2); the second conductive blocks (211) in the second binding assembly (21) overlap the first conductive blocks (111) bound and connected thereto, and the change rate of the overlapping state of the second binding assembly (21) in the first direction is less than 0.102%.