摘要:
This invention relates to silane moisture curable polymer composition and more particularly, to such a polymer composition that is highly diluted by a non-silane containing component, while retaining good high temperatures properties. The invention is a polymer composition comprising a base resin comprising less than 59wt% of a silane crosslinkable polyethylene (A), an thermoplastic polyolefin free from silane groups (B) wherein the polymer composition comprise a filler with a BET Nitrogen Surface Area larger than 3 m 2 /g (C). The invention also relates to a cable layer of such polymer composition suitably a semiconducting layer of a power cable.
摘要翻译:本发明涉及硅烷可湿气固化的聚合物组合物,更具体地涉及这样一种聚合物组合物,其被含有不含硅烷的组分高度稀释,同时保持良好的高温性能。 本发明是一种聚合物组合物,其包含含有小于59重量%的硅烷可交联聚乙烯(A)的基础树脂,不含硅烷基团的热塑性聚烯烃(B),其中聚合物组合物包含BET比氮表面积大于3 m 2 / g(℃)。 本发明还涉及这样的聚合物组合物的电缆层,合适地是电力电缆的半导体层。
摘要:
The invention relates to a crosslinkable semiconductive polymer composition comprising (a) a polyolefin, carbon black and a compound (b), to a cable, preferably to a crosslinkable comprising the polymer composition, to a production thereof, and preferably to a crosslinked cable comprising the polymer composition of the invention.
摘要:
The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt% of a polymer component, (b) from 10 to 70 wt% of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt% of a polymer component as defined above and 0-8 wt% additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt% of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.
摘要:
The present invention relates to a high-pressure radical ethylene polymerization process in which ethylene is polymerized with a polyunsaturated olefin comprising at least 6 carbon atoms and at least two non-conjugated double bonds of which at least one is terminal, characterized in that a polyunsaturated olefin grade is used as a starting material which yields a percentage of less than 6.3% in the zero conversion test or which has a decomposition temperature as measured by DSC of 130° C. or more.
摘要:
The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.
摘要:
This invention relates to silane moisture curable polymer composition and more particularly, to such a polymer composition that is highly diluted by a non-silane containing component, while retaining good high temperatures properties. The invention is a polymer composition comprising a base resin comprising less than 59wt% of a silane crosslinkable polyethylene (A), an thermoplastic polyolefin free from silane groups (B) wherein the polymer composition comprise a filler with a BET Nitrogen Surface Area larger than 3 m 2 /g (C). The invention also relates to a cable layer of such polymer composition suitably a semiconducting layer of a power cable.
摘要翻译:本发明涉及硅烷可湿固化的聚合物组合物,更具体地说,涉及这样一种由非含硅烷组分高度稀释的聚合物组合物,同时保持良好的高温性能。 本发明是一种聚合物组合物,其包含基础树脂,其包含少于59重量%的硅烷可交联聚乙烯(A),不含硅烷基团的热塑性聚烯烃(B),其中所述聚合物组合物包含BET氮氮表面积大于3的填料 m 2 / g(℃)。 本发明还涉及这种聚合物组合物的电缆层,适当地是电力电缆的半导体层。
摘要:
The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.
摘要:
The present invention relates to a high-pressure radical ethylene polymerization process in which ethylene is polymerized with a polyunsaturated olefin comprising at least 6 carbon atoms and at least two non-conjugated double bonds of which at least one is terminal, characterized in that a polyunsaturated olefin grade is used as a starting material which yields a percentage of less than 6.3% in the zero conversion test or which has a decomposition temperature as measured by DSC of 130° C. or more.