公开(公告)号：EP1023635A4

公开(公告)日：2005-11-23

申请号：EP98936011

申请日：1998-07-24

申请人： CANDESCENT INTELLECTUAL PROP

发明人： CHANG DAVID C ,  LEARN ARTHUR J ,  MACKEY BOB L ,  DRUMM PAUL M ,  MORRIS DAVID L

IPC分类号： H01J9/227 ,  G03F7/00 ,  H01J9/18 ,  H01J9/24 ,  G03C5/00 ,  H01J9/00

CPC分类号： G03F7/0035 ,  G03F7/0007 ,  H01J9/185 ,  H01J9/242 ,  H01J2329/863

摘要： A method for forming a three-dimensional multi-level conductive matrix structure for a flat panel display device. In one embodiment, the present invention forms first pixel separating structures across a surface of a faceplate of a flat panel display. The first pixel separating structures separate adjacent first sub-pixel regions. In this embodiment, the first pixel separating structures are formed by applying a first layer of photo-imagable material across the surface of the faceplate. Next, portions of the first layer of photo-imagable material are removed to leave regions of the first layer of photo-imagable material covering respective first sub-pixel regions. Then, a first layer of conductive material is applied over the surface of the faceplate such that the first layer conductive material is disposed between the aforementioned regions of the first layer of photo-imagable material. The present invention then removes the regions of the first layer of photo-imagable material leaving only first pixel separating structures formed of the first layer of conductive material, disposed between the first sub-pixel regions. The present invention performs similar steps in order to form second pixel separating structures between the second sub-pixel regions. The second pixel separating structures are formed substantially orthogonally oriented with respect to the first pixel separating structures and, in the present embodiment, have a different height than the first pixel separating structures. In so doing, a three-dimensional multi-level conductive matrix structure is formed.

摘要翻译： 一种用于形成平板显示装置的三维多层导电矩阵结构的方法。 在一个实施例中，本发明在平板显示器的面板的表面上形成第一像素分离结构。 第一像素分离结构分离相邻的第一子像素区域。 在该实施例中，通过在面板的表面上施加第一层可光成像材料来形成第一像素分离结构。 接下来，去除第一层可光成像材料的部分，以留下覆盖相应的第一子像素区域的第一层可光成像材料的区域。 然后，将第一层导电材料施加在面板的表面上，使得第一层导电材料设置在第一层可光成像材料的上述区域之间。 然后，本发明除去第一层可光成像材料的区域，仅留下由设置在第一子像素区域之间的第一导电材料层形成的第一像素分离结构。 为了在第二子像素区域之间形成第二像素分离结构，本发明执行类似的步骤。 第二像素分离结构基本上相对于第一像素分离结构基本上正交地定向，并且在本实施例中，具有与第一像素分离结构不同的高度。 这样做形成三维多层导电矩阵结构。