摘要:
The invention relates to a lead-free, low-melting glass for covering a substrate. This glass contains 0.1-25 wt% of SiO 2 , 1-50 wt% of B 2 O 3 , 1-45 wt% of ZnO, 20-90 wt% of Bi 2 O 3 , 0.1-40 wt% of V 2 O 5 , 0-5 wt% of Nb 2 O 5 , 0-20 wt% of R 2 O where R is Li, Na or K, and 0-20 wt% of RO where R is Mg, Ca, Sr or Ba. This glass has a thermal expansion coefficient of from 65 × 10 -7 /°C to 100 × 10 -7 /°C within a range of 30-300°C; and has a softening point of not higher than 630°C.
摘要翻译:本发明涉及一种用于覆盖基板的无铅低熔点玻璃。 该玻璃含有0.1-25重量%的SiO 2,1-50重量%的B 2 O 3,1-45重量%的ZnO,20-90重量%的Bi 2 O 3,0.1-40重量%的V 2 O 5,0-5重量%的Nb 2 O 5 ,0-20重量%的R 2 O,其中R是Li,Na或K,和0-20重量%的RO,其中R是Mg,Ca,Sr或Ba。 该玻璃在30〜300℃的范围内的热膨胀系数为65×10 -7 /℃至100×10 -7 /℃; 且软化点不高于630℃。
摘要:
A transparent, electric insulating, low-melting glass for covering a substrate includes chemical components of SiO 2 , B 2 O 3 , BaO and ZnO. This low-melting glass has a thermal expansion coefficient of from 65 × 10 -7 /°C to 95 × 10 -7 /°C within a range of 30-300°C; a softening point of not higher than 600°C; and a dielectric constant of not greater than 7.5 at a frequency of 1 MHz under room temperature.