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1.发明公开An integrated circuit anti-bridging leads design 审中-公开ÜberbrückungsgeschützterAnschlussleiterentwurf einer integrierten Schaltung
公开(公告)号：EP0898309A3
公开(公告)日：2000-02-09
申请号：EP98306673.9
申请日：1998-08-20
申请人： CTS Corporation
CPC分类号： H05K3/3426 , H01L23/3135 , H01L2924/0002 , Y02P70/613 , H01L2924/00
摘要： An IC package design and method of making the package design that provides anti-bridging between metal leads. The anti-bridge IC package design (10) extends bottom covercoat material (50) out onto the leads (14) a sufficient distance to prevent solder bridging that typically takes place in cup regions of gull wing shaped leads. A further feature of the invention is to provide a method of applying covercoat material (50) to the IC (10) and the leads (14) in the same process step. A resilient material wheel (60) and related manufacturing equipment is used to apply a single covercoat material (50), like epoxy, in a single step that serves as both the bottom covercoat and lead anti-bridge coat for the IC (10).
摘要翻译： 该封装包括陶瓷体（16），其上设有电阻网络（12）。 一组电引线的一端嵌入陶瓷体。 电引线在两个区域弯曲，以在陶瓷体的侧表面和底表面之间形成杯区域。 电引线通过安装在陶瓷体上的相应导体连接到电阻网络。 提供绝缘覆盖物（50）以覆盖陶瓷体，电阻网络，导体和电引线到弯曲部分。
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公开(公告)号：EP0898309A2
公开(公告)日：1999-02-24
申请号：EP98306673.9
申请日：1998-08-20
申请人： CTS Corporation
CPC分类号： H05K3/3426 , H01L23/3135 , H01L2924/0002 , Y02P70/613 , H01L2924/00
摘要： An IC package design and method of making the package design that provides anti-bridging between metal leads. The anti-bridge IC package design extends bottom covercoat material out onto the leads a sufficient distance to prevent solder bridging that typically takes place in cup regions of gull wing shaped leads. A further feature of the invention is to provide a method of applying covercoat material to the IC and the leads in the same process step. A resilient material wheel and related manufacturing equipment is used to apply a single covercoat material, like epoxy, in a single step that serves as both the bottom covercoat and lead anti-bridge coat for the IC.
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