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1.
公开(公告)号:EP0896042B1
公开(公告)日:2005-02-09
申请号:EP98305999.9
申请日:1998-07-28
CPC分类号: C23F3/00 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要: A chemical mechanical polishing composition and slurry comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition and slurry to polish tungsten containing substrates.