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公开(公告)号:EP4390933A1
公开(公告)日:2024-06-26
申请号:EP22315346.1
申请日:2022-12-21
发明人: Sabbione, Chiara , Navarro, Gabriele , Tessaire, Magali , Frei, Michel Ranjit , Nistor, Lavinia-Elena
CPC分类号: H10N70/8828 , H10N70/231 , H10N70/041 , H10N70/826 , G11C13/0004 , H10N70/026 , H10N70/235
摘要: The invention relates to a material stack, a microelectronic device that integrates such stack and a method for obtaining such stack.
A non-limitative application of the invention relates to Phase-Change Memory device. The material stack (10) for microelectronic device (1) comprises:
a. A substrate (11),
b. A first undoped crystalline layer (12) on the substrate, said undoped crystalline layer having a thickness superior to 4 nm, and
c. A Si-doped crystalline chalcogenide layer (13) on the undoped crystalline layer, said Si-doped crystalline chalcogenide layer being doped with less than 20 at.%, and preferably less than 12 at.%, of Si.
The provided material stack shows a satisfying stability contributing to retard the stack possible reorganization (i.e. intermixing) that could happen during the manufacturing of the material stack and during the subsequent manufacturing of said microelectronic device.