摘要:
A sensor module and method for producing the sensor module including a chip carrier and a sensor chip disposed thereon. The sensor module includes at least one partial cover having a recess on a second face of the chip carrier, such that heat from the chip carrier and/or the sensor chip can be dissipated to the recess.
摘要:
The invention relates to a mass flow sensor (LMM) comprising at least one sensor element (SU). The mass flow sensor (LMM) further comprises a sensor chip (CHP1), which comprises a first and an opposite second chip side (CHP1_1, CHP1_2). The at least one sensor element (SU) is arranged on the first chip side (CHP1_1), and at least one electrical contact (SP) is arranged on the second chip side (CHP1_2). The at least one electrical contact (SP) is electrically coupled to the at least one sensor element (SU) by means of at least one electrical connection (CP1, V, SCP). The mass flow sensor (LMM) comprises a sensor holder element (LF), which comprises at least one electrical line (CP2) and at least one electrical contact area (CA), which is electrically coupled to the at least one electrical line (CP2). The sensor chip (CHP1) is arranged on the sensor holder element (LF) in such a way that the at least one electrical contact (SP) on the second chip side (CHP1_2) of the sensor chip (CHP1) is electrically coupled to the at least one electrical contact area (CA) of the sensor holder element (LF).