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    SENSORANORDNUNG UND VERFAHREN ZUM EINFACHEN EINBAU IN EIN FAHRZEUG
    1.
    发明公开
    SENSORANORDNUNG UND VERFAHREN ZUM EINFACHEN EINBAU IN EIN FAHRZEUG 审中-公开
    传感器组件和方法简单安装在车辆中的

    公开(公告)号：EP2340412A1

    公开(公告)日：2011-07-06

    申请号：EP09783847.8

    申请日：2009-10-08

    申请人： Continental Teves AG & Co. oHG

    发明人： HILSER, Roland ,  BURGHARDT, Roland ,  SCHMID, Bernhard ,  HEIMEL, Jörg ,  THEOBALD, Dirk

    IPC分类号： G01C25/00 ,  G01P15/18 ,  G01C21/16

    CPC分类号： G01C25/00 ,  G01C21/16 ,  G01P15/18 ,  G01P21/00 ,  Y10T29/49764 ,  Y10T29/49826

    摘要： The invention relates to a method for installing a sensor arrangement into a vehicle having a vehicle chassis, wherein the vehicle chassis is in a defined position during the installation and the sensor arrangement is fastened directly or indirectly to the vehicle chassis, wherein the sensor arrangement comprises one or more acceleration sensors (1) having three linearly independent measuring directions and the sensor arrangement comprises an electronic control unit (3) which is designed in such a way that said electronic control unit has a sensor calibration mode, wherein after the sensor arrangement is fastened, the at least one acceleration sensor measures the gravitational acceleration, whereupon in the sensor calibration mode the electronic control unit calculates and stores one or more relative positioning parameters from at least the measured direction of the gravitational acceleration (g). Said relative positioning parameters comprise at least one piece of information about the relative positioning between the sensor arrangement and the vehicle chassis.

    MIKROMECHANISCHER BESCHLEUNIGUNGSSENSOR
    2.
    发明公开
    MIKROMECHANISCHER BESCHLEUNIGUNGSSENSOR 有权
    MICRO机械加速度传感器

    公开(公告)号：EP2263093A1

    公开(公告)日：2010-12-22

    申请号：EP09728656.1

    申请日：2009-04-03

    申请人： Continental Teves AG & Co. oHG

    发明人： BURGHARDT, Roland ,  HILSER, Roland ,  SCHMID, Bernhard ,  ALBRECHT, Veith ,  THEOBALD, Dirk

    IPC分类号： G01P15/18 ,  G01P15/125

    CPC分类号： G01P15/18 ,  G01P15/125

    摘要： Micromechanical acceleration sensor, comprising at least one substrate (1), one or more frames (2, 2a, 2b), of which at least one first frame (2, 2b) is directly or indirectly suspended on the substrate (1) by means of at least one spring element (3, 3b) and is deflected upon the action of at least one first acceleration with respect to the substrate (1), and at least one first seismic mass (9, 9a), which is suspended on the first (2, 2b) or an additional frame (2a) by means of at least one spring element (7, 7a) and is deflected upon the action of an acceleration, which, in particular, differs from the first acceleration, with respect to said frame (2, 2a).

    GEHÄUSESEITIGE TRENNSCHICHT ZUR STRESSENTKOPPLUNG VON VERGOSSENEN ELEKTRONIKEN
    3.
    发明公开
    GEHÄUSESEITIGE TRENNSCHICHT ZUR STRESSENTKOPPLUNG VON VERGOSSENEN ELEKTRONIKEN 审中-公开
    GEHÄUSESEITIGETRENNSCHICHT ZUR STRESSENTKOPPLUNG VON VERGOSSENEN ELEKTRONIKEN

    公开(公告)号：EP2695499A1

    公开(公告)日：2014-02-12

    申请号：EP12714640.5

    申请日：2012-04-04

    申请人： Continental Teves AG & Co. oHG

    发明人： HUBER, Dietmar ,  SCHILLINGER, Jakob ,  THEOBALD, Dirk

    IPC分类号： H05K5/06 ,  H05K5/00

    CPC分类号： H05K7/14 ,  H05K5/0056 ,  H05K5/064

    摘要： The invention relates to a device (2), which comprises a substrate (12) for carrying an electrical circuit (14), a housing (4) for enclosing the substrate (12), and a potting compound (22) accommodated in the housing (4), which potting compound at least partially encloses the substrate (12). The potting compound (22) can adhere to the housing (4). Furthermore, the device has a wall (26), from which the potting compound (22) can detach.

    摘要翻译： 本发明涉及一种装置，其包括用于承载电路的基板，用于封装基板的壳体和容纳在壳体中的灌封化合物，该灌封化合物至少部分地包围基底。 灌封胶可以粘附到外壳上。 此外，该装置具有壁，灌封化合物从该壁可以分离。