公开(公告)号：EP0801803B1

公开(公告)日：2002-06-05

申请号：EP95933119.0

申请日：1995-09-12

申请人： Cooper Industries, Inc.

发明人： WHITNEY, Stephen ,  SPALDING, Keith ,  WINNETT, Joan ,  KALRA, Varinder

IPC分类号： H01H85/04 ,  H01H69/02 ,  H01H85/041

CPC分类号： H01H85/0411 ,  H01H69/02 ,  H01H69/022 ,  H01H85/0418 ,  H01H85/046 ,  H01H2085/0414

摘要： A subminiature circuit protector (10) includes at least one layer of ceramic material having at least one fuse element (24) and a cover (20) in a laminate structure. The ends (12, 14) of laminate structure are coated with electrically conductive end terminations (30, 32). Where a layer has more than one fuse element (24), the fuse elements may be connected in parallel or interconnected in series. Each of the fuse elements (24) of the individual layers may comprise two or more individual fuse elements connected in series or parallel. A method for manufacturing the circuit protector (10) includes the steps of printing a multiplicity of fuse elements (24) on a plurality of green ceramic substrates (40), stacking the substrates (40) to form a laminate structure (60), cutting the laminate (60) into individual units (70), firing the individual units (70), and coating the opposite ends (12, 14) of the units with electrically conductive material to form end terminations (30, 32).