DURABLE GLASS HOUSINGS/ENCLOSURES FOR ELECTRONIC DEVICES
    2.
    发明公开
    DURABLE GLASS HOUSINGS/ENCLOSURES FOR ELECTRONIC DEVICES 审中-公开
    于电子设备的永久性住房GLASS / MOUNTS

    公开(公告)号:EP2334613A1

    公开(公告)日:2011-06-22

    申请号:EP09789189.9

    申请日:2009-08-21

    申请人: Corning Inc.

    摘要: The invention relates to glass articles suitable for use as electronic device housing/ enclosure or protective cover which comprise a glass material. Particularly, a housing/enclosure/cover comprising an ion-exchanged glass exhibiting the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa?m
    ½ ; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm
    2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus ranging between about 50 to 100 GPa;; (7) a thermal conductivity of less than 2.0 W/m°C, and (9) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.