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公开(公告)号:EP2323955A1
公开(公告)日:2011-05-25
申请号:EP09773929.6
申请日:2009-07-02
申请人: Corning Inc.
发明人: AMIN, Jaymin , BEALL, George, H. , BEALL, Lorrie, F. , DEJNEKA, Matthew, J. , PINCKNEY, Linda, R. , ROSSINGTON, Katherine, R.
IPC分类号: C03C3/118 , C03C3/112 , C03C3/083 , C03C3/093 , C03C3/097 , C03C10/00 , C03C10/16 , C03C21/00
CPC分类号: C03C3/118 , C03C3/083 , C03C3/093 , C03C3/097 , C03C3/112 , C03C10/00 , C03C10/0009 , C03C10/0027 , C03C10/0045 , C03C10/16 , C03C21/002
摘要: The invention relates glass ceramic articles suitable for use as electronic device housing or enclosures which comprise a glass-ceramic material. Particularly, a glass-ceramic article housing/enclosure comprising a glass-ceramic material exhibiting both radio and microwave frequency transparency, as defined by a loss tangent of less than 0.5 and at a frequency range of between 15 MHz to 3.0 GHz, a fracture toughness of greater than 1.5 MPa⋅m
½ , an equibiaxial flexural strength (ROR strength) of greater than 100 MPa, a Knoop hardness of at least 400 kg/mm
2 , a thermal conductivity of less than 4 W/m°C and a porosity of less than 0.1 %.-
2.
公开(公告)号:EP2334613A1
公开(公告)日:2011-06-22
申请号:EP09789189.9
申请日:2009-08-21
申请人: Corning Inc.
发明人: AMIN, Jaymin , DEJNEKA, Matthew, John , PINCKNEY, Linda, R , ROSSINGTON, Katherine, R , SABIA, Robert
CPC分类号: C03C21/002 , C03C3/083 , C03C3/087 , C03C3/091 , C03C3/093 , Y10T428/131 , Y10T428/24355 , Y10T428/265
摘要: The invention relates to glass articles suitable for use as electronic device housing/ enclosure or protective cover which comprise a glass material. Particularly, a housing/enclosure/cover comprising an ion-exchanged glass exhibiting the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa?m
½ ; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm
2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus ranging between about 50 to 100 GPa;; (7) a thermal conductivity of less than 2.0 W/m°C, and (9) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.
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