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公开(公告)号：EP3583081A1
公开(公告)日：2019-12-25
申请号：EP18708791.1
申请日：2018-02-15
申请人： Corning Incorporated
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公开(公告)号：EP2948415A1
公开(公告)日：2015-12-02
申请号：EP14703718.8
申请日：2014-01-23
申请人： Corning Incorporated
发明人： BERGMAN, Richard , DANNOUX, Thierry Luc Alain , DARCANGELO, Charles Michael , DENEKA, David Alan , GRAY, Stuart , JAIN, Priyank Paras
CPC分类号： C03B23/0235 , B23K26/0075 , B23K26/40 , B23K2203/50 , B24B9/10 , B32B17/10036 , B32B17/10155 , C03B17/02 , C03B25/025 , C03B33/023 , C03C15/00 , C03C19/00 , Y10T428/2419 , Y10T428/24264
摘要： Disclosed is a laminated glass structure with one or more inner glass layers with at least one in tension and two outer glass layers in compression wherein one or both of the outer layers at least partially wrap around the one or more inner layers at one or more of the edges of the laminated glass structure. Also disclosed is a process for forming a laminated glass structure, comprising providing a laminated glass structure, removing at least some glass from at least one the edges of the structure to produce a concavity in at the at least one edge and applying heat to the at least one edge.
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公开(公告)号：EP4126774A1
公开(公告)日：2023-02-08
申请号：EP21781805.3
申请日：2021-03-30
申请人： Corning Incorporated
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公开(公告)号：EP3717414A1
公开(公告)日：2020-10-07
申请号：EP18819505.1
申请日：2018-11-29
申请人： Corning Incorporated
发明人： DENEKA, David Alan , FREDHOLM, Allan Mark , JOUBAUD, Laurent , MATUSICK, Joseph Michael , PALUMBO, Aniello Mario , PIERRON, Christophe
IPC分类号： C03B17/02
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公开(公告)号：EP4126773A1
公开(公告)日：2023-02-08
申请号：EP21780740.3
申请日：2021-03-30
申请人： Corning Incorporated
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公开(公告)号：EP3212589A1
公开(公告)日：2017-09-06
申请号：EP15797204.3
申请日：2015-10-29
申请人： Corning Incorporated
发明人： BOEK, Heather Debra , DABICH, Leonard Charles II , DENEKA, David Alan , KIM, Jin Su , KOVAL, Shari Elizabeth , LOGUNOV, Stephan Lvovich , QUESADA, Mark Alejandro , STRELTSOV, Alexander Mikhailovich
IPC分类号： C03C3/14 , C03C3/247 , C03C17/02 , C03C17/06 , C03C17/23 , C03C23/00 , C03C27/04 , C03C27/06 , C03C27/10 , H01L51/52
CPC分类号： C03C23/0025 , C01G19/02 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C15/00 , C03C17/02 , C03C17/06 , C03C17/23 , C03C27/044 , C03C27/06 , C03C27/10 , H01L51/5246
摘要： A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ
tensile stress location )/(σ
interface laser weld )) interface laser weld > 10 MPa or > 1 MPa where σ
tensile stress location is the stress present in the first substrate and σ
interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.摘要翻译： 一种形成密封装置的方法，包括提供具有第一表面的第一衬底，提供与第一衬底相邻的第二衬底，以及在第一衬底与相邻第二衬底的界面之间形成焊接，其中焊接的特征在于（ （σ应力位置）/（σ界面激光焊接））<< 1或<1，σ界面激光焊接> 10 MPa或> 1 MPa，其中σtensile应力位置是存在于第一个衬底中的应力，σ接口激光焊接应力存在于 界面。 该方法可用于制造各种不同的密封包装。
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