Moisture-curable hot melt pressure sensitive adhesives
    1.
    发明公开
    Moisture-curable hot melt pressure sensitive adhesives 失效
    可湿固化热熔压敏粘合剂

    公开(公告)号:EP0688847A3

    公开(公告)日:1996-10-30

    申请号:EP95304113.4

    申请日:1995-06-14

    IPC分类号: C09J183/04 C09J183/14

    摘要: A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising: (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula -ZSiR 1 x (OR 2 ) 3-x ; wherein R 1 is a monovalent hydrocarbon radical, R 2 is selected from alkyl radical or alkoxyalkyl radical, Z is a divalent linking radical, and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25°C. of 20 to 100,000 mm 2 /s, and the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; and (C) sufficient catalyst to accelerate the cure of said composition; said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.

    Moisture-curable hot melt silicone pressure-sensitivie adhesives
    2.
    发明公开
    Moisture-curable hot melt silicone pressure-sensitivie adhesives 失效
    Durch Feuchtigkeit vernetzbare,druckempfindliche Schmelzklebestoffe auf Basis von Polysiloxane。

    公开(公告)号:EP0628617A2

    公开(公告)日:1994-12-14

    申请号:EP94304151.7

    申请日:1994-06-09

    IPC分类号: C09J183/04

    摘要: A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising (i) a solid hydroxyl-functional organopolysiloxane resin comprising R₃SiO 1/2 siloxane units and SiO 4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, respectively, wherein R is selected from hydrocarbon and halogenated hydrocarbon radicals and said hydroxyl content is 1.2 to 6 percent by weight; (ii) an alkoxy-functional diorganopolysiloxane polymer having a viscosity at 25°C. of 20 to 100,000 mPa·s (centipoise), the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; (iii) a silane of the formula R' 4-y SiX y , in which R' is selected from hydrocarbon radicals and substituted hydrocarbon radicals having 1-6 carbon atoms, X is a hydrolyzable group and y is 2 to 4, the amount of said silane being sufficient to provide stability to said composition; and (iv) sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.

    摘要翻译: 公开了一种可湿气固化的硅氧烷热熔压敏粘合剂组合物,所述组合物包含(i)包含摩尔比为0.5 / 1至1.2的R3SiO1 / 2硅氧烷单元和SiO4 / 2硅氧烷单元的固体羟基官能的有机聚硅氧烷树脂 / 1,其中R选自烃和卤代烃基,所述羟基含量为1.2至6重量%; (ii)在25℃下的粘度为20至100,000mPa.s(厘泊)的烷氧基​​官能的二有机聚硅氧烷聚合物,所述树脂与所述聚合物的重量比在40:60至80:20的范围内; (iii)式R'4-ySiXy的硅烷,其中R'选自烃基和具有1-6个碳原子的取代的烃基,X是可水解基团,y是2至4,所述 硅烷足以提供对所述组合物的稳定性; 和(iv)足够的催化剂以加速所述组合物的固化,所述组合物在室温下基本上是无溶剂的非坍落度固体,其在暴露于水分时可固化成基本上非粘性的弹性体。

    Moisture-curable hot melt silicone pressure-sensitive adhesives
    3.
    发明授权
    Moisture-curable hot melt silicone pressure-sensitive adhesives 失效
    基于聚硅氧烷可湿固化热熔压敏粘合剂,

    公开(公告)号:EP0628617B1

    公开(公告)日:1998-05-20

    申请号:EP94304151.7

    申请日:1994-06-09

    IPC分类号: C09J183/04

    摘要: A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising (i) a solid hydroxyl-functional organopolysiloxane resin comprising R3SiO1/2 siloxane units and SiO4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, respectively, wherein R is selected from hydrocarbon and halogenated hydrocarbon radicals and said hydroxyl content is 1.2 to 6 percent by weight; (ii) an alkoxy-functional diorganopolysiloxane polymer having a viscosity at 25 DEG C. of 20 to 100,000 mPa.s (centipoise), the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; (iii) a silane of the formula R'4-ySiXy, in which R' is selected from hydrocarbon radicals and substituted hydrocarbon radicals having 1-6 carbon atoms, X is a hydrolyzable group and y is 2 to 4, the amount of said silane being sufficient to provide stability to said composition; and (iv) sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.

    Oxime-functional moisture-curable hot melt silicone pressure-sensitive adhesives
    4.
    发明公开
    Oxime-functional moisture-curable hot melt silicone pressure-sensitive adhesives 失效
    可湿固化,热熔压敏基于与Oximegruppen聚硅氧烷funktionnilisierten粘合剂。

    公开(公告)号:EP0628618A2

    公开(公告)日:1994-12-14

    申请号:EP94304167.3

    申请日:1994-06-09

    IPC分类号: C09J183/04

    摘要: A moisture-curable silicone hot-melt adhesive composition is disclosed, which composition comprises

    (i) a solid hydroxyl-functional organopolysiloxane resin comprising R₃SiO 1/2 siloxane units and SiO 4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, wherein R is selected from hydrocarbon or halogenated hydrocarbon radicals;
    (ii) a diorganopolysiloxane polymer having silicon-bonded hydroxyl terminal groups and having a viscosity at 25°C. of 100 to 500,000 mPa·s (centipoise), the weight ratio of said resin (i) to said polymer being (ii) in the range 40:60 to 75:25;
    (iii) a ketoximosilane, the amount of said ketoximosilane being sufficient to provide a molar ratio of X groups to total hydroxyl groups on said resin (i) and said diorganopolysiloxane (ii) of 0.9 to 3; and
    (iv) optionally, sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free non-slump solid at room temperature, being extrudable at ≦150°C. and forming an essentially tack-free elastomer when cured.

    摘要翻译: 湿气固化型有机硅的热熔粘合剂组合物盘游离缺失,该组合物包括(i)固体羟基官能化的有机聚硅氧烷树脂,其包含R3SiO1 / 2的硅氧烷单元和SiO4 / 2硅氧烷单元的摩尔比0.5 / 1至1.2 / 1 ,worin R选自烃或卤代烃基基团; (ii)具有硅键合的羟基末端基团并具有在25℃下100至500,000 mPa·s为(厘泊)中,所述树脂(I)的重量比的粘度与所述聚合物是二有机聚硅氧烷聚合物(II) 范围40:60至75:25; (Ⅲ)酮肟基硅烷,酮肟基硅烷的量所说的足以提供X基团与总羟基的在所述树脂(i)的摩尔比和0.9〜3。所述二有机聚硅氧烷(II); 和(iv)任选地,足够的催化剂,以加速所述组合物的固化,所述组合物基本上不含溶剂的非坍落度固体在室温下,在

    Moisture-curable hot melt silicone pressure-sensitivie adhesives
    5.
    发明公开
    Moisture-curable hot melt silicone pressure-sensitivie adhesives 失效
    湿气基于聚硅氧烷的可固化,热熔压敏粘合剂。

    公开(公告)号:EP0628617A3

    公开(公告)日:1995-08-30

    申请号:EP94304151.7

    申请日:1994-06-09

    IPC分类号: C09J183/04

    摘要: A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising (i) a solid hydroxyl-functional organopolysiloxane resin comprising R₃SiO 1/2 siloxane units and SiO 4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, respectively, wherein R is selected from hydrocarbon and halogenated hydrocarbon radicals and said hydroxyl content is 1.2 to 6 percent by weight; (ii) an alkoxy-functional diorganopolysiloxane polymer having a viscosity at 25°C. of 20 to 100,000 mPa·s (centipoise), the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; (iii) a silane of the formula R' 4-y SiX y , in which R' is selected from hydrocarbon radicals and substituted hydrocarbon radicals having 1-6 carbon atoms, X is a hydrolyzable group and y is 2 to 4, the amount of said silane being sufficient to provide stability to said composition; and (iv) sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.

    Curable silicone pressure sensitive adhesive tape
    7.
    发明公开
    Curable silicone pressure sensitive adhesive tape 失效
    Klebeband aushärtbaremSilikon-Haftkleber。

    公开(公告)号:EP0529546A1

    公开(公告)日:1993-03-03

    申请号:EP92114348.3

    申请日:1992-08-21

    摘要: A pressure sensitive adhesive tape comprising a tape substrate having at least a portion of one or more sides coated with a silicone pressure sensitive adhesive is constructed using an adhesive which cures to a permanent adhesive. The adhesive is covered on the outer side with a release film, preferably coated with a fluorosilicone release layer, to allow storage of the tape. Preferably, the curable silicone pressure sensitive adhesive is cured upon exposure to moisture, the tape therefore being stored in the absence of moisture. A silicone elastomeric structural glazing tape is made by using a silicone elastomer as the tape substrate. The tape can be used to bond glazing panels to building components without the use of other means of fastening.

    摘要翻译: 包括具有涂覆有硅氧烷压敏粘合剂的一个或多个侧面的至少一部分的带基材的压敏粘合带使用固化到永久粘合剂的粘合剂来构造。 粘合剂在外侧被剥离膜覆盖,优选地涂覆有氟硅氧烷释放层,以允许带的存储。 优选地,可固化的硅氧烷压敏粘合剂在暴露于水分时固化,因此胶带在没有水分的情况下储存。 通过使用硅氧烷弹性体作为带基材制造有机硅弹性体结构玻璃胶带。 胶带可用于将玻璃板粘合到建筑部件上,而不需要使用其他固定方式。

    Moisture-curable hot melt pressure sensitive adhesives
    8.
    发明授权
    Moisture-curable hot melt pressure sensitive adhesives 失效
    可湿固化热熔压敏粘合剂

    公开(公告)号:EP0688847B1

    公开(公告)日:2003-08-13

    申请号:EP95304113.4

    申请日:1995-06-14

    IPC分类号: C09J183/04 C09J183/14

    摘要: A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising: (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula -ZSiR x(OR )3-x; wherein R is a monovalent hydrocarbon radical, R is selected from alkyl radical or alkoxyalkyl radical, Z is a divalent linking radical, and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25 DEG C. of 20 to 100,000 mm /s, and the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; and (C) sufficient catalyst to accelerate the cure of said composition; said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.

    Method for bonding substrates using molten moisture reactive organosiloxane compositions
    10.
    发明公开
    Method for bonding substrates using molten moisture reactive organosiloxane compositions 失效
    一种用于由熔融水硬化的聚硅氧烷的方法接合基板表面处理。

    公开(公告)号:EP0628619A2

    公开(公告)日:1994-12-14

    申请号:EP94304168.1

    申请日:1994-06-09

    IPC分类号: C09J183/04

    CPC分类号: C09J183/04 C08L83/00

    摘要: Curable adhesive compositions comprise combinations of organosiloxane MQ resins and liquid polyorganosiloxanes of specified viscosity and functionality. The compositions are substantially free of unreactive materials and are applied in the molten state. Depending upon the concentration of reactive groups on the resin and polyorganosiloxane, the compositions may also include a silane containing an average of more than two hydrolyzable groups per molecule. Preferred compositions develop excellent adhesion to a variety of organic and metallic substrates during curing under ambient conditions.

    摘要翻译: 可固化粘合剂组合物包含有机硅氧烷MQ树脂和上指定的粘度和功能的液态聚有机硅氧烷的组合。 所述组合物基本上不含非反应性材料,并且在熔融状态下被施加。 根据在树脂和聚有机硅氧烷的反应性基团的浓度,所述组合物因此可以包括硅烷含有平均每分子多于两个可水解基团。 优选的组合物开发环境条件下固化时优良的粘合性的各种有机和金属基板的。