摘要:
A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula wherein R is a C 1-4 hydrocarbon radical, M 1 is a hydrogen atom or alkali metal atom, M 2 is an alkali metal atom, and X 1 and X 2 are each a hydrogen atom, OH, COON, or SO 3 N (where N represents a hydrogen atom or alkali metal atom).
摘要:
An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode (2) and a plurality of cathodes (4) in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes (5,6) into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive α particle counts of less than 0.1 CPH/cm 2 .