Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use
    4.
    发明公开
    Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use 失效
    用于生产铅磺酸盐和具有锡磺酸盐使用用于焊接涂层电解过程

    公开(公告)号:EP0770708A1

    公开(公告)日:1997-05-02

    申请号:EP95115894.8

    申请日:1995-10-09

    IPC分类号: C25B3/00 B01D61/44

    CPC分类号: C25B3/00 C25D3/60

    摘要: An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode (2) and a plurality of cathodes (4) in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes (5,6) into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive α particle counts of less than 0.1 CPH/cm 2 .

    摘要翻译: 的制造铅和锡磺酸盐,其包括施加直流电压到阳极处(2)和电解池的阴极(4)的多个部分并加以从而溶解铅或锡,在电解液中的电解过程。 的电解池是由阳离子和阴离子交换膜(5,6)转换成阳极室和阴极室隔开。 电解液是一种有机磺酸的溶液中,并将阳极是铅或锡。 该过程减少放射性同位素的内容:使用雅舞蹈的铅和锡的盐,与小于0.1 CPH的发明展放射性α粒子计数通过焊料镀敷形成,例如铀和钍到小于50ppb的水平,因此,涂层/ 厘米<2>。