公开(公告)号：EP2257610A2

公开(公告)日：2010-12-08

申请号：EP09724991.6

申请日：2009-03-26

申请人： Diemat, Inc.

发明人： CZUBAROW, Pawel ,  DIETZ, Raymond, L. ,  PATELKA, Maciej

IPC分类号： C09J9/00 ,  C09J11/04

CPC分类号： C09J11/04 ,  C08K3/38 ,  C08K7/00 ,  C09J11/08 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal interface material comprises larger conformable thermally conductive particles, and smaller ceramic thermally conductive particles in a binder. The binder can include thermoplastic (and optionally thermoset) particles and a fugitive liquid which are substantially insoluble in each other. The binder can also include a liquid epoxy. Each of the larger thermally conductive particles is itself a cohesive yet conformable agglomeration of platy particles.