-
公开(公告)号:EP4394053A1
公开(公告)日:2024-07-03
申请号:EP23208440.0
申请日:2023-11-08
CPC分类号: C21D1/667 , C21D1/613 , C21D1/58 , C21D9/0025 , C21D9/0018 , C21D9/0062 , C21D9/32
摘要: The present disclosure relates to a cooling device for heat treatment that performs heat treatment by cooling individually or as a whole a heated metal object. The cooling device for heat treatment includes: a chamber within which a plurality of objects is disposed; an individual cooling unit configured to individually cover the object and to spray a cooling medium onto the object; and a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction.