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公开(公告)号：EP0869515B1
公开(公告)日：2002-02-27
申请号：EP98105809.2
申请日：1998-03-30
发明人： Kobayashi, Akihiko, Dow Corning Toray Sil. Co.Ltd. , Mine, Katsutoshi, Dow Corning Toray Sil. Co. Ltd. , Nakamura, Takashi, Dow Corning Toray Sil. Co. Ltd. , Sasaki, Motoshi, Dow Corning Toray Sil. Co. Ltd. , Sawa, Kiyotaka, Dow Corning Toray Sil. Co. Ltd.
IPC分类号： H01B3/46 , C04B41/50 , C09D183/04
CPC分类号： H01L21/02134 , C04B41/009 , C04B41/4966 , C04B41/84 , C04B2111/00844 , C09D183/04 , H01B3/46 , H01L21/02282 , H01L21/3121 , C04B41/0072 , C04B41/4554 , C04B41/5035 , C04B35/00
摘要： Herein we provide a composition for the formation of insulating films that have a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.
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2.发明公开Composition and process for forming electrically insulating thin films 失效Zusammensetzung und Verfahren zum Bilden von elektrisch isolierendenDünnschichten
公开(公告)号：EP0869515A1
公开(公告)日：1998-10-07
申请号：EP98105809.2
申请日：1998-03-30
发明人： Kobayashi, Akihiko, Dow Corning Toray Sil. Co.Ltd. , Mine, Katsutoshi, Dow Corning Toray Sil. Co. Ltd. , Nakamura, Takashi, Dow Corning Toray Sil. Co. Ltd. , Sasaki, Motoshi, Dow Corning Toray Sil. Co. Ltd. , Sawa, Kiyotaka, Dow Corning Toray Sil. Co. Ltd.
IPC分类号： H01B3/46 , C04B41/50 , C09D183/04
CPC分类号： H01L21/02134 , C04B41/009 , C04B41/4966 , C04B41/84 , C04B2111/00844 , C09D183/04 , H01B3/46 , H01L21/02282 , H01L21/3121 , C04B41/0072 , C04B41/4554 , C04B41/5035 , C04B35/00
摘要： Herein we provide a composition for the formation of insulating films that have a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.
摘要翻译： 这里我们提供一种用于形成具有低介电常数的绝缘膜的组合物。 该组合物包含（A）选自电绝缘性可固化有机树脂和电绝缘性可固化无机树脂的电绝缘性可固化树脂; 和（B）至少两种溶剂：（B）（i）能够溶解树脂（A）和（B）的溶剂（ii）沸点或蒸气压曲线不同于溶剂（B）（i ）或其对树脂（A）的亲和性与溶剂（B）（i）的亲和性不同。 还要求保护的是形成介电常数小于2.7的绝缘膜的方法。
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公开(公告)号：EP0869516A1
公开(公告)日：1998-10-07
申请号：EP98105810.0
申请日：1998-03-30
发明人： Kobayashi, Akihiko, Dow Corning Toray Sil. Co.Ltd. , Mine, Katsutoshi, Dow Corning Toray Sil. Co. Ltd. , Nakamura, Takashi, Dow Corning Toray Sil. Co. Ltd. , Sasaki, Motoshi, Dow Corning Toray Sil. Co. Ltd. , Sawa, Kiyotaka, Dow Corning Toray Sil. Co. Ltd.
IPC分类号： H01B3/46 , C04B41/50 , C09D183/04
CPC分类号： H01L21/02134 , C09D183/04 , H01B3/46 , H01L21/02282 , H01L21/312
摘要： Herein, we provide a composition and process for forming insulating films that produce low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0°C to 800°C. Our insulating films are prepared by coating the surface of a substrate with the above composition; evaporating the solvent ; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).
摘要翻译： 在此，我们提供用于形成产生低介电常数的绝缘膜的组合物和工艺。 （A）可电绝缘固化的无机或有机树脂，（B）溶剂和（C）至少一种溶剂可溶性物质（不包括用于组分（B）的溶剂），其通过加热或通过与 树脂（A）可以在0℃至800℃的温度范围内产生气体或挥发。 我们的绝缘膜是通过用上述组合物涂覆基底的表面而制备的; 蒸发溶剂; 随后在所述树脂（A）的固化过程中或之后加热基材以从组分（C）产生气体。
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公开(公告)号：EP0869516B1
公开(公告)日：2002-09-11
申请号：EP98105810.0
申请日：1998-03-30
发明人： Kobayashi, Akihiko, Dow Corning Toray Sil. Co.Ltd. , Mine, Katsutoshi, Dow Corning Toray Sil. Co. Ltd. , Nakamura, Takashi, Dow Corning Toray Sil. Co. Ltd. , Sasaki, Motoshi, Dow Corning Toray Sil. Co. Ltd. , Sawa, Kiyotaka, Dow Corning Toray Sil. Co. Ltd.
IPC分类号： H01B3/46 , C04B41/50 , C09D183/04
CPC分类号： H01L21/02134 , C09D183/04 , H01B3/46 , H01L21/02282 , H01L21/312
摘要： Herein, we provide a composition and process for forming insulating films that produce low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0 DEG C to 800 DEG C. Our insulating films are prepared by coating the surface of a substrate with the above composition; evaporating the solvent ; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).
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