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    Silicone composition for forming cured release films
    1.
    发明公开
    Silicone composition for forming cured release films 有权
    Siliconzusammensetzung zur Herstellung vernetzter Trennbeschichtungen

    公开(公告)号：EP1004632A1

    公开(公告)日：2000-05-31

    申请号：EP99123417.0

    申请日：1999-11-24

    申请人： Dow Corning Toray Silicone Company, Ltd.

    发明人： Koyama, Taku ,  Togashi, Atsushi ,  Yamada, Takateru

    IPC分类号： C08L83/04

    CPC分类号： C09D183/04 ,  C08L83/00 ,  C08L2666/28

    摘要： This invention relates to a silicone composition comprising: (A) a mixture of (i) a linear trimethylsiloxy-terminated polydiorganosiloxane containing at least 2 alkenyl groups having at least 4 carbon atoms per molecule and (ii) optionally a linear dimethylalkenylsiloxy-terminated polydiorganosiloxane, (B) a polyorganohydrogensiloxane, (C) a catalytic quantity of a platinum catalyst, and (D) an inhibitor. The silicone compositions of this invention make it possible to form cured release films with low resistance to peeling when peeling is carried out at high speeds, and with the possibility of controlling the resistance to peeling between low and high values when peeling is carried out at low speeds. The silicone compositions of this invention also are not subject to a decrease in the coefficient of residual adhesion in the adhesive material applied onto a cured release film.

    摘要翻译： 本发明涉及一种硅氧烷组合物，其包含：（A）（i）每分子含有至少2个具有至少4个碳原子的链烯基的直链三甲基甲硅烷氧基封端的聚二有机硅氧烷的混合物，和（ii）任选的直链二甲基链烯基甲硅烷氧基封端的聚二有机硅氧烷， （B）聚有机氢硅氧烷，（C）催化量的铂催化剂，和（D）抑制剂。 本发明的硅酮组合物使得可以在高速进行剥离时形成具有低剥离性的固化的剥离膜，并且可以在低温下进行剥离时控制耐低温和高剥离之间的剥离性 速度。 本发明的硅酮组合物也不会降低施加到固化的脱模膜上的粘合剂材料中的残留粘合系数。