专利检索 ap:("Dow Global Technologies LLC") AND inv:"PUTANS, Rebecca" 第 1 页

1.

发明公开
RESINS FOR USE AS TIE LAYER IN MULTILAYER STRUCTURE AND MULTILAYER STRUCTURES COMPRISING THE SAME 审中-公开

公开(公告)号：EP3774334A1

公开(公告)日：2021-02-17

申请号：EP19716023.7

申请日：2019-03-07

申请人： Dow Global Technologies LLC

发明人： WALTHER, Brian W. , PUTANS, Rebecca , WAN, Qichun , LI, Yongfu , BROONER, Rachel E. M. , BISHOP, Matthew T. , ZHENG, Yong

IPC分类号： B32B27/00 , C08L23/08 , C08L23/16