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公开(公告)号：EP2017374A2
公开(公告)日：2009-01-21
申请号：EP08018576.2
申请日：2001-03-16
申请人： EBARA CORPORATION
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/06 , C25D21/04 , C25D21/10 , C25D21/12
摘要： There is provided an apparatus suited for forming a plated film in fine trenches and plugs for interconnects, and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and for forming bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed; a plating tank accommodating a plating liquid in which an anode is immersed; a diaphragm provided in the plating tank and disposed between the anode and the substrate held by the substrate. holder; plating liquid circulating systems for circulating the plating liquid to the respective regions of the plating tank separated by the diaphragm; and a deaerating unit disposed in at least one of the plating liquid circulating systems.
摘要翻译： 提供了一种适合于形成用于互连的精细沟槽和插塞中的电镀膜的装置，以及形成在诸如半导体晶片的基板的表面中的抗蚀剂的开口中，并且用于在表面上形成凸块（突出电极） 的半导体晶片。 该装置包括能够打开和关闭用于保持基板的基板保持器，使得基板的前表面在其背侧和边缘被气密密封的同时露出; 容纳浸渍有阳极的电镀液的电镀槽; 设置在电镀槽中并设置在阳极和由基板保持的基板之间的隔膜。 持有人; 电镀液循环系统，用于将电镀液循环到由隔膜分隔的镀槽的各个区域; 以及设置在所述电镀液循环系统中的至少一个中的脱气单元。
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公开(公告)号：EP2017374A3
公开(公告)日：2011-04-27
申请号：EP08018576.2
申请日：2001-03-16
申请人： EBARA CORPORATION
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/06 , C25D21/04 , C25D21/10 , C25D21/12
摘要： There is provided an apparatus suited for forming a plated film in fine trenches and plugs for interconnects, and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and for forming bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed; a plating tank accommodating a plating liquid in which an anode is immersed; a diaphragm provided in the plating tank and disposed between the anode and the substrate held by the substrate. holder; plating liquid circulating systems for circulating the plating liquid to the respective regions of the plating tank separated by the diaphragm; and a deaerating unit disposed in at least one of the plating liquid circulating systems.
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