公开(公告)号：EP1605559A4

公开(公告)日：2007-10-31

申请号：EP04819418

申请日：2004-11-25

申请人： ENPLAS CORP

发明人： HAYAKAWA K

IPC分类号： G01R31/26 ,  H01L23/32 ,  H01R13/193 ,  H01R13/24 ,  H01R33/76 ,  H05K7/10

CPC分类号： H05K7/1069 ,  H01R13/193 ,  H01R13/24

摘要： A contact pin is made to be in elastic contact with an electrode surface provided on the bottom surface of an electric component, with the electric component reliably connected and fixed in place. A lever (36) is provided on a socket body (2) so as to operate in conjunction with the vertical movement of a socket cover (3). As the socket cover (3) lowers, the lever (36) applies pressing force to a second contact pin (28) to push down a contact section (31), and as the socket cover (3) rises, an electric component is fixed to a seating plate (9) and the pressing force by the lever (36) is released to cause the contact section (31) to be in elastic contact with the bottom surface of the electric component. The structure enables a contact pin to be in elastic contact with an electrode surface provided on the bottom surface of an electric component with the electric component reliably connected and fixed in place.