FRAME FOR A HEAD MOUNTED DEVICE
    1.
    发明公开
    FRAME FOR A HEAD MOUNTED DEVICE 审中-公开
    用于头戴式设备的框架

    公开(公告)号:EP3258308A1

    公开(公告)日:2017-12-20

    申请号:EP16305710.2

    申请日:2016-06-13

    IPC分类号: G02C11/00 G02C7/08

    摘要: Frame for a head mounted device comprising:
    - a front part,
    - a first temple configured to be electronically connected to said front part via a first connection means and comprising battery means for providing electrical power arranged in a cavity in the first temple and connected electrically to the first connection means,
    - a second temple configured to be electrically connected to said front part and having a cavity therein configured to receive therein at least one electronic module, and
    a second connection means configured to connect electrically the battery means of the first temple to the at least one electronic module of the second temple via the front part to receive power therefrom.

    摘要翻译: 一种用于头戴式设备的框架,包括: - 前部, - 第一镜腿,所述第一镜腿被构造成经由第一连接装置电连接到所述前部,并且包括用于提供电力的电池装置,所述电力设置在所述第一镜腿中的腔中并且电连接 至第一连接装置;第二镜腿,所述第二镜腿被构造为电连接至所述前部并且具有在其中的空腔,所述空腔构造成在其中容纳至少一个电子模块;以及第二连接装置,所述第二连接装置构造成电连接第一太阳穴的电池装置 通过前部连接到第二太阳穴的至少一个电子模块以从其接收电力。

    EYEGLASSES FRAME COMPRISING EMBEDDED ELECTRONICS
    2.
    发明公开
    EYEGLASSES FRAME COMPRISING EMBEDDED ELECTRONICS 审中-公开
    眼罩框架包含嵌入式电子设备

    公开(公告)号:EP3184289A1

    公开(公告)日:2017-06-28

    申请号:EP15307074.3

    申请日:2015-12-21

    IPC分类号: B29D12/02

    摘要: The invention is related to a method of manufacturing of a composite substrate comprising an embedded electronic device by forming in a first substrate a cavity for receiving the electronic device; disposing the electronic device between the first substrate and a second substrate in said cavity; providing a solvent of cellulose acetate in-between the first substrate and the second substrate, maintaining the first substrate and the second substrate in contact together, wherein the electronic device is maintained between the first substrate and the second substrate, forming the composite substrate.

    摘要翻译: 本发明涉及一种制造包括嵌入式电子器件的复合衬底的方法,通过在第一衬底中形成用于接收电子器件的空腔; 将电子器件布置在所述腔中的第一基板和第二基板之间; 在第一基板和第二基板之间提供乙酸纤维素溶剂,将第一基板和第二基板保持接触在一起,其中电子器件保持在第一基板和第二基板之间,形成复合基板。