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公开(公告)号:EP2653022A2
公开(公告)日:2013-10-23
申请号:EP11815620.7
申请日:2011-12-16
申请人: Eaton Corporation
发明人: MILLS, Patrick, Wellington , MCCORMICK, James, Michael , HANLEY, Kevin, Francis , BUDD, Timothy, Richey
CPC分类号: H05K7/20445 , H05K7/209
摘要: A matrix assembly is provided for an electrical system such as, for example, a power distribution unit for an aircraft. The electrical system includes an enclosure and a number of current carrying components such as, for example, electrical bus members, electrical switching apparatus, and/or fuses. The matrix assembly includes a matrix member having a generally planar portion, a plurality of attachment points for attaching the current carrying components to the generally planar portion, and a plurality of mounting points for attaching the generally planar portion to a thermally conductive structure such as, for example, an aluminum airframe structure. The matrix member is a thermally conductive liquid crystalline polymer. In addition to providing dielectric insulation, the matrix member also effectively transfers heat away from the current carrying components to the aluminum airframe structure, thereby reducing the temperature and corresponding electrical resistance within the electrical system and improving performance.
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公开(公告)号:EP2543057A1
公开(公告)日:2013-01-09
申请号:EP10847146.7
申请日:2010-07-15
申请人: Eaton Corporation
发明人: MILLS, Patrick, Wellington , MCCORMICK, James, Michael , HANLEY, Kevin, Francis , BUDD, Timothy, Richey
IPC分类号: H01H85/12
CPC分类号: H01H50/12 , H01H1/62 , H01H50/02 , H01H50/14 , H01H50/541
摘要: A thermally managed electromagnetic switching device (2) is provided that includes a current carrying component set (4) switchable between a closed, current carrying state and an open, current interrupting state. A thermally dissipating component set (6) functionally supports and electrically isolates the current carrying component set (4) in the open state. The thermally dissipating component set (6) includes at least in part a thermally conductive polymer and is cooperatively configured to transfer heat away from the current carrying component set (4) in the closed state to dissipate thermal energy.
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