公开(公告)号：EP2797342A8

公开(公告)日：2015-02-11

申请号：EP13004359.9

申请日：2013-09-05

Applicant: Em-tech. Co., Ltd.

Inventor： Kim, Ji Hoon ,  Kwon, Joong Hak ,  Lee, Jung Hyung ,  Oh, Hyeon Taek

IPC: H04R9/04 ,  H04R31/00 ,  H04R7/04 ,  H04R7/14

CPC classification number: H04R7/02 ,  H04R7/14 ,  H04R9/043 ,  H04R31/003

Abstract: The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.

公开(公告)号：EP2797341A1

公开(公告)日：2014-10-29

申请号：EP13004360.7

申请日：2013-09-05

Applicant: Em-tech. Co., Ltd.

Inventor： Kim, Ji Hoon ,  Kwon, Joong Hak ,  Lee, Jung Hyung ,  Oh, Hyeon Taek

IPC: H04R7/16 ,  H04R31/00

CPC classification number: H04R1/00 ,  H04R1/06 ,  H04R7/16 ,  H04R31/003

Abstract: The present invention relates to a suspension for a sound transducer. The present invention discloses a suspension for a sound transducer, to which a diaphragm and voice coil of the sound transducer are attached and which guides the vibrations of the diaphragm and voice coil, comprising: a central portion to which a voice coil is attached; an outer peripheral portion resting on a frame; and a connecting portion connecting the central portion and the outer peripheral portion, wherein the central portion has a mold portion, which is molded by heat or pressure to take the place of a center diaphragm.

Abstract translation: 用于声音换能器的悬架 本发明公开了一种用于声音换能器的悬架，声音换能器的振膜和音圈连接到所述声音换能器，并且所述声音换能器引导振动膜和音圈的振动，该悬架包括：中心部分，音圈附接到所述中心部分; 放置在框架上的外周部分; 以及连接中央部分和外周部分的连接部分，其中中央部分具有模制部分，该模制部分通过热或压力成型以取代中心隔膜。

公开(公告)号：EP2797341B1

公开(公告)日：2016-03-30

申请号：EP13004360.7

申请日：2013-09-05

Applicant: Em-tech. Co., Ltd.

Inventor： Kim, Ji Hoon ,  Kwon, Joong Hak ,  Lee, Jung Hyung ,  Oh, Hyeon Taek

IPC: H04R7/16 ,  H04R31/00

CPC classification number: H04R1/00 ,  H04R1/06 ,  H04R7/16 ,  H04R31/003

公开(公告)号：EP2797342A1

公开(公告)日：2014-10-29

申请号：EP13004359.9

申请日：2013-09-05

Applicant: Em-tech. Co., Ltd.

Inventor： Kim, Ji Hoon ,  Kwon, Joong Hak ,  LeeE, Jung Hyung ,  Oh, Hyeon Taek

IPC: H04R9/04 ,  H04R31/00 ,  H04R7/04 ,  H04R7/14

CPC classification number: H04R7/02 ,  H04R7/14 ,  H04R9/043 ,  H04R31/003

Abstract: The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.

Abstract translation: 本发明涉及一种用于微型扬声器的隔膜的组装结构。 本发明公开了一种用于微型扬声器的隔膜的接合结构，该结构包括：悬架，其包括中心部分，外周部分和连接中心部分和外周部分的连接部分; 以及分别安装在悬架的中心部分和外周部分上的包括内周部分和外周部分的侧面隔膜以及在内周部分和外周部分之间突出的圆顶部分， 其中所述悬架和所述侧隔膜通过热压力附接。