公开(公告)号：EP4283672A1

公开(公告)日：2023-11-29

申请号：EP23174589.4

申请日：2023-05-22

申请人： Epistar Corporation ,  Yenrich Technology Corporation

发明人： HUANG, Li-Yuan ,  WANG, Tzu-Hsiang ,  PU, Chi-Chih ,  LIN, Ya-Wen ,  LI, Pei-Yu ,  CHIU, Hsiao-Pei

IPC分类号： H01L25/16

摘要： A pixel package includes a base material, a circuit structure, a plurality of light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, a plurality of bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base.