摘要:
A hybrid integration process is provided for fabrication of an optical cross-connect switching apparatus (8). The switching apparatus (8) is based on the deflection of light beams in electro-optic materials by applying an electric field across electrodes of an appropriate configuration. The integration process includes fabrication of a substrate (e.g. silicon substrate 30) with 2D imaging optics from polymeric materials (or silica), fabrication of the light deflecting element, and assembly of the deflecting element on the substrate with imaging optics. The fabrication of the light deflecting element includes fabrication of a LN (lithium niobate) block (12). The LN block (12) assembled in an optical switching apparatus includes a two-dimensional waveguide (14) formed on a surface of the LN block (12) and an electrode on a surface of the LN block.
摘要:
A hybrid integration process is provided for fabrication of an optical cross-connect switching apparatus (8). The switching apparatus (8) is based on the deflection of light beams in electro-optic materials by applying an electric field across electrodes of an appropriate configuration. The integration process includes fabrication of a substrate (e.g. silicon substrate 30) with 2D imaging optics from polymeric materials (or silica), fabrication of the light deflecting element, and assembly of the deflecting element on the substrate with imaging optics. The fabrication of the light deflecting element includes fabrication of a LN (lithium niobate) block (12). The LN block (12) assembled in an optical switching apparatus includes a two-dimensional waveguide (14) formed on a surface of the LN block (12) and an electrode on a surface of the LN block.